Model 8000 Wire Bonder & Ball Bumper
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Applications: Large Complex Hybrids System In Packages (SIPs) Multichip Modules (MCMs) Automotive Assemblies LEDs with running Stitch Disk Drive Assemblies Flex Circuits Chip On Board (COB) Specialty Leadframes Fine Pitch Devices High Speed Thermosonic Ball Bonder The Model 8000 fully automatic, thermosonic, highspeed ball-and-stitch wire bonder and gold bumper improves production yields and eliminates sources of variation in your process. Feature and Benfits: Innovative handling systems eliminate indexing time to create non-stop bonding (zero wait state). The large work area accommodates a wide variety of part sizes, allowing for production flexibility. True orthogonal bonding consistently produces high quality bonds at varying surface heights over a 20 mm range. Model 8000 Wire Bonder Linear motors and linear encoders with sub- micron resolution ensure accurate and repeatable bond placement. The 8000 uses its unique bond-head motion (patented dual Z-axis with rotary motion) to form precise gold bumps by repeatably shearing the wire off the top of the bump without leaving a tail. This provides the consistent formation of flat <20-micron high bumps, thus eliminating the need for a secondary coining process. An industry-best finished bond height consistency of 2 microns is achieved with ұ2.5 micron, 3 sigma placement accuracy. Gold wire is used for a lead-free process. A graphical interface, hierarchical tree controls, and set-up wizards simplify calibration, set-up, and programming. All the features of a semicondutor wire bonder and a hybrid wire bonder integrated in one compact, flexible unit. The overall precision of the Model 8000 enables fine pitch, high wire count applications to be processed at high yield. The Model 8000 Single Process Co-planar Gold Bumper is the only machine that can produce planarized gold bumps in one step. Palomar Technologies Inc. 2728 Loker Avenue West Carlsbad, CA 92010 Phone 760.931.3600 Fax 760.931.5191 >

Specifications Capabilities Key Features: One step planar gold bumps formed without leaving a tail; ideal for Au flip chip. Bond Type Thermosonic ball and wire bonding, ball bumping Cycle Time 0.125 sec/wire, 0.077 sec/bump Deep access capability enables wire placement into deep electronic packages. Wire Pitch 50 micron (using 20.0 micron wire) Placement Accuracy 2.5 micron, 3 sigma Large bonding area 12є x 6 X-Y bond area minimizes index time and improves throughput. Deep Access 0.75Ԕ tool (optional) Bond Area 12 x 6Ԕ Automated assembly of quality components results in extremely high...