Model 6500 Precision Eutectic Die Bonder
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Applications: P-Side Down Laser Diode Attachment Silicon Bench (V-Groove) Placement High Density RF Power Transistors Ultra-Fine Pitch Hybrid Assemblies MEMS Components VCSEL Modules Flip Chip on Glass Data Storage Features: Post-process accuracies of 1.5 micron, 3 Ultra-high accuracy eutectic and adhesive placements with cycle times less than 7 seconds High-speed, four-axis positioning system Six position, bi-directional tool turret changes tools rapidly Fully automatic substrate and part loading (optional) The combined speed, accuracy, and compact footprint of the Palomar Technologies Model 6500 make an unmatched case for yielded throughput and cost of ownership in high accuracy assembly systems. The compact system footprint fits into a 4 x 4 foot area, reducing clean room cost. A large work area (6 x 12 inch) eliminates the need to purchase additional pick/place heads. The bonder features automated tracking of placement and RAM statistics; reduced equipment cost per package and worldwide service and support. A low force bond head enables pick and placement of fragile compound semiconductor and crystal components without damage.The six-position, bi- directional tool turret changes tools rapidly on the fly, maximizing throughput and reducing changeover time without traveling to a tool dock. The Model 6500 is designed specifically for fully automatic, high speed, precision hybrid component assembly. The system performs ultra-high accuracy eutectic and adhesive placements with cycle times under 7 seconds using its high-speed, 4-axis positioning system driven by linear motors gliding over air bearings on a steel based frame. Palomars submicron axis resolution results in typical post-process accuracies of 1.5 micron, 3. An advanced Cognex pattern recognition system locates randomly oriented die and enables multiple alignment algorithms including area, point, and edge alignment. This system includes auto focusing with programmable on- and off-axis lighting systems to maximize contrast and accuracy in component placement. Operating in a WindowsҮ XP-based environment, the Model 6500 brings unparalleled software flexibility, power, and ease of use to precision hybrid component assembly. The user-friendly interface assists in bonding setup, operation, diagnostics, and calibration. Palomar Technologies Inc. 2728 Loker Avenue West Carlsbad, CA 92010 Phone 760.931.3600 Fax 760.931.5191 >

Pattern Recognition: Vision System 256 Gray-Scale Cognex Series 8000 system. PR Theta Application Dependent Focus Range Programmable focus across 0.400Δ (lens floats with Z-axis) Objective Lenses 2 selectable look-down, one fixed look-up camera Programmable Lighting LED ring light and through the lens lighting, programmed separately Hardware & Facility Requirements: Operating System Windows XP Power 200, 208, 220, or 240 VAC +/- 5%, 50 or 60Hz, single phase, 30 AMP, transient-free conditioned power Air at Bonder 150 PSIG +20, -5 PSIG Inlet 7 SCFM minimum at air bearings; dry air maintained...