Applications: Flip Chip Chip-On-Board HB LED Assembly, MicroWave Modules, RF packages Hybrid Circuits Fine Pitch SMT MEMs, Laser diodes Features: Large work area, various presentation tools, Steady State and Pulsed Heat Eutectic Bonding, high accuracy motion system, multiple dispense technologies, die ejectors, Cognex Vision system, and much more. Benefits: Accommodates many applications types, accurate die placement, prototyping, high mix, low volume, flexible layout. The Model 3500-III is designed for fully automatic, precision microelectronics assembly. The flexible, computer-controlled workcell performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a spacious 710-in > Model 3500-III Die Bonder 2 work area. The honeycomb core machine base provides vibration damping and thermal settling response superior to granite. Submicron axis resolution yields typical placement accuracies of 0.5 mil (12.7 ѵm) with fluids, down to 0.2 mil (5 ѵm) using Pulsed Heat Eutectic processes. The cantilever design permits unobstructed, open access on three sides for setup and an infrared light curtain ensures operator safety during production. Soft touchdown assists in precise pickup and placement of fragile devices such as GaAs. An 8- position turret head can rapidly change tools on the fly without a space-consuming tool dock. The advanced Cognex gray-scale pattern recognition system locates randomly oriented device features under a wide variety of background conditions and lighting. The PR system includes auto focus, contrast enhancement, averaging, synthetic modeling/masking, capacitor find, centroid modeling, and programmable magnification and light intensity. Utilizing the Windows XP Pro operating system, the 3500-III Bonder Control Software brings unparalleled versatility, power and ease of use to microelectronics assembly. The graphical, user-friendly interface assists in bonding setup, operation, diagnostics, and calibration. Model 3500-III options include equipment for fully automatic substrate handling: input, preheat, eutectic heating stage, cool down and transfer. Many other options are available to meet special application requirements for custom cells and in-line systems: Automatic dispense in series with pick/place Waffle pak, gel pak, and tape and reel presentation Motorized expanded wafer die ejectors Automatic pulsed heat eutectic die attach assembly Complete in-line component assembly Flip chip; pneumatic mechanism inverts chip Palomar Technologies Inc. 2728 Loker Avenue West Carlsbad, CA 92010 Phone 760.931.3600 Fax 760.931.5191 >

Multi-axis Cartesian Robot Specifications 710in > 2 (35.5 x 20Ԕ) work envelope Placement Accuracy 0.0005є (12.7 m) True Radial Position depending on application 0.0002є (5 m) with Pulse Heat Eutectic processing Axis speeds near 40 ips with resolution of 0.5 m over work area; linear encoders are used for absolute positioning Ranges: Z-axis = 2 ; = >365԰ Die Size Range 0.007 to >2Ԕ plus large odd form factor components Patented digital servo control VME bus multiprocessor design X, Y, Z Axis Resolution X and Y = 0.0000196 (0.5 m), Z = 0.000025Ԕ (0.6 m) Infrared Safety Light Curtain 4 axes standard;...