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Model 3470-II Wedge Bonder
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Model 3470-II Wedge Bonder
Product catalog summary
Overview
Palomar Technologies offers advanced wedge bonding solutions with both new and refurbished models. The Model 2470-V and 3470-II are designed for demanding applications, providing precise control and extensive features for large area bonding.
Specifications
Key Features
Advanced Functions
Vision System
Conclusion
Palomar Technologies' wedge bonders are designed to lower the cost of precision while offering robust features and flexibility for complex bonding requirements.
Palomar Technologies offers advanced wedge bonding solutions with both new and refurbished models. The Model 2470-V and 3470-II are designed for demanding applications, providing precise control and extensive features for large area bonding.
Specifications
- Model 2470-V: Proven platform with a 16”2 or optional 24”2 work stage, capable of moving over a 60”2 area.
- Model 3470-II: Larger work envelope of 32.5” x 19.5”, suitable for large assemblies or multiple setups.
Key Features
- Precise loop and wire length control to reduce rework and test iterations.
- Dual-mode ultrasonics with over 100 programmable power levels for various bonding surfaces.
- Large 2-in. wire spool and optional de-spooler for efficient wire management.
- Mega-program capability for storing up to 8000 wires in a single program.
- Host Data Option for software integration with external CIM computers.
- On-screen menus for guided setup and operation.
Advanced Functions
- Extensive programmable bonding functions including bond locations, force levels, and loop shapes.
- Quick tool change and centering software for faster setup and changeovers.
- Self-diagnostic software for calibration and troubleshooting.
- Optional software routines for enhanced functionality, including SPC Tracking and CAD Upload/Download.
Vision System
- Advanced Cognex 5400 Series vision system with up to 256 gray-scale levels for pattern recognition.
- Look-down camera with auto focus and zoom optics for clear imaging at various bonding levels.
Conclusion
Palomar Technologies' wedge bonders are designed to lower the cost of precision while offering robust features and flexibility for complex bonding requirements.
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Catalog excerpts
Extensive programmable bonding functions include bond locations, height, individual force levels, ultrasonic power, direction, duration, loop shape, and tail length (for first and second bonds to accommodate varying surfaces). Quick tool change and centering software allows faster setup, changeovers in wire size and threading. Self-diagnostic software assists in calibration and troubleshooting. Optional software routines include Automatic Program Documentation, Orthogonal Wiring, Proportional Referencing, Rework, Set Layout, Statistical Process Control (SPC) Tracking, Light Tower Indicator, and...
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