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V series
Product catalog summary
Vacuum Reflow Soldering System Overview
This document provides the specifications for the Vacuum Reflow Soldering System models VS1 and VS2.
Specifications
- Number of Chambers: Both models feature a single chamber.
- Dimensions: The VS1 model measures W850 x D500 x H1,300 mm, while the VS2 model measures W850 x D850 x H1,460 mm.
- Process Area: Both models have a process area of W200 x D250 x H60 mm.
- Reducing Agent: Utilizes formic acid at a concentration of 98%.
- Heating: Equipped with IR heaters capable of reaching temperatures up to 400℃.
- Cooling: Features a water-cooled plate for cooling.
- Thermometer: Uses a thermocouple for temperature measurement.
- Vacuum Pump: Both models use a corrosion-proof type dry pump, maintaining a vacuum of 20Pa or less.
- Vacuum Gauge: Equipped with a capacitance diaphragm gauge.
- Auto-load/Unload Unit: The VS1 model requires manual loading, while the VS2 model includes standard equipment for automatic loading and unloading.
- Exhaust Treatment: An optional formic acid decomposition unit is available.
See more
Catalog excerpts
Vacuum Reflow Soldering System Model: VS1/VS2 Specification Specification Process area Reducing agent Water-cooled plate Vacuum pump Corrosion-proof type dry pump Vacuum gauge Capacitance diaphragm gauge Auto-load/unload unit - (Manual loading) Exhaust treatment - (Option : Formic acid decomposition unit) Standard equipment
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.