MP2
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MP2
Product catalog summary
Overview: The document provides specifications for the MP2 Vacuum Reflow Soldering System, detailing its components and operational parameters.
Specifications:
- Chamber Configuration: The system includes two chambers, one for heating and one for cooling.
- Dimensions: The overall dimensions of the system are 1,880 mm in width, 1,800 mm in depth, and 2,140 mm in height.
- Process Area: The process area measures 380 mm in width, 310 mm in depth, and 100 mm in height.
- Reducing Agent: Utilizes formic acid at a concentration of 98%.
- Heating: Equipped with IR heaters capable of reaching temperatures up to 400℃.
- Cooling: Features a water-cooled plate for cooling processes.
- Temperature Measurement: Uses a thermocouple for temperature monitoring.
- Vacuum Pump: A corrosion-proof type dry pump is used, maintaining pressure at 20Pa or less.
- Vacuum Gauge: Includes a capacitance diaphragm gauge and a Pirani gauge for vacuum measurement.
Optional Features:
- Auto-load/unload Unit: Customizable options available for automatic transfer within chambers.
- Exhaust Treatment: An optional formic acid decomposition unit is available for exhaust treatment.
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Catalog excerpts
Vacuum Reflow Soldering System Model: MP2 Specification Number of chamber Process area Reducing agent Water-cooled plate Vacuum pump Corrosion-proof type dry pump Vacuum gauge Capacitance diaphragm gauge, Pirani gauge Auto-load/unload unit - (Option : Customizable) * Auto-transfer in chambers Exhaust treatment - (Option : Formic acid decomposition unit)
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.