Wafer and PCB control with Opto's 'Machine Vision Microscopes' (1 page)

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Wafer and PCB control with Opto's 'Machine Vision Microscopes' (1 page)

Product catalog summary

Wafer and PCB Control with Opto’s ‘Machine Vision Microscopes’

Customer Task:

PCB Inspection to identify soldering defects.
Testing of ICs, FPGA chips, and Ball Grid Arrays (BGA).
Semiconductor Inspection with fast image acquisition.
Utilization of Differential Interference Contrast (DIC) for high resolution and optimal contrast.
Software control through Opto SDK.

Advantages for Customer:

All-in-one digital microscope solution.
More compact than regular digital microscopes.
Highest image quality with excellent color repeatability.
Optimized for mobile use and easy machine integration.
Ultra-compact design.

Solution:

Imaging Module IM•compact M available in monochrome or color versions.
Easy-to-use OptoViewer 2.0 software included.
Image processing capabilities with available plug-ins.
Integrated transmission illumination for direct measurement without calibration.
USB 3.0 / GigE connectivity for plug and play functionality.

Figure 1: Demonstrates defect identification using different illumination concepts – bright-field vs. dark field.

Catalog excerpts

Wafer and PCB control with Opto's 'Machine Vision Microscopes' (1 page)-1

Test & Measurement / Semicon Electronics Wafer and PCB Control with Opto’s ‘Machine Vision Microscopes’ PCB Inspection – find soldering defects Testing IC,s FPGA chips, Ball Grid Arrays (BGA) Semiconductor Inspection Fast image acquisition DIC (Differential Interference Contrast) High resolution, optimal contrast with the Opto SDK they control their software Imaging Module IM•compact M Monochrome or colour version Easy to use and free OptoViewer 2.0 software Image Processing Plug Ins available Integrated transmission illumination Direct measurement without calibration USB 3.0 / GigE available – Plug and Play Pure all in one digital microscope More compact than regular digital microscope Highest image quality with huge color repeatability Optimized for mobile use Easy machine integration Ultra compact design Fig. 1: Defect identification using different illumination concepts – brightfield (left) vs. dark field (right) 07/2022 - Design and technical development are subject to change without notice. © Opto GmbH | TM_SE_IC_22-07.1 www.opto-gmbh.com Opto GmbH • Floriansbogen 2/4 • 8206

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