VT-X700-E, VT-X700-L
4Pages

High-speed automated X-ray CT inspection system

Market Trends and Issues Miniaturization Density enhancement The higher the engineering demands, the greater the challenge in Jisso (surface mounting) design. Compromised solder joint strength Miniaturized chips Bottom surface electrodes (BGA or CSP) Narrow pitches Shield mounting Enhanced need of hidden joint inspection Solder joint reliability must be ensured while overcoming various design constraints. Omron's X-Ray Inspection System with 3D-CT Method The 3D-CT method enables the inspection of indistinct X-ray camera shapes which 2D or pseudo CT cannot detect. 2D method (transparent)...

Pinpoint Inspection 3D-CT Method The cross-sectional images of relevant inspection targets can be easily selected from abundant camera-image libraries to ensure precise fault detection. too ooo Full coverage High-Output X-Ray Source Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source. Component types Through Hole Device (THD) Lead components Transistors, gull-wing type (SOP • QFP) Insufficient soldering Insufficient soldering Power devices (e.g. IGBT, MOS-FET) : Imaging cross section * The 3D...

• This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions. • This product may cause interference if used in residential areas. OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION AOI SALES DEPARTMENT Shinagawa Front Bldg. Conference 7F 2-3-13 Kounan Minato-ku Tokyo 108-0075 JAPAN TEL +81-3-6718-3550 FAX:+81-3-6718-3553 OMRON INDUSTRIAL AUTOMATION...