WH/WN SeriesMiniature Molded Wirewound •WH precision series • WN Aryton Perry winding Non-Inductive series: Inductance <1nH at 1MHZ test, • Designed to meet MIL-R-26F, MIL-STD-202 standard requirements • Manufacturing process -Wire winding/ Spot Welding- by Computer Numerical Control (CNC) machine tools to ensure consistency of product quality. • Encapsulated by epoxy molding compound • Advanced IC encapsulation mold/die technologies Power Resistance Rating Range Weight Ceramic Core CeramTec Rubalit® 85% alumina End Caps Stainless steel, precision formed Leads Copper wire,100% Sn (lead free) coated Resistance Wire ISAOHM® wire TC ±20ppm/°C Encapsulation SUMICON 1100/1200 Epoxy molding compound for IC encapsulation Standard Tolerance D (0.5%), F (1.0%), J (5.0%) Temperature ±90 for 0.100Q-0.99Q, ±50 for Coefficient (ppm/°C) 1.00Q-10.00Q, ±20 for >10.00Q Maximum Working (PxR)1/2 Voltage Derating Linearly from 100% @ +70°C to 0% @ +150°C. Operating Temp -55°C to +150°C Width Pitch Diam. reel Type Wattage L D d 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.

PERFORMANCE CHARACTERISTiCS Test Conditions of Test Performance Thermal shock Environmental chamber, -55°C +0°C, -3°C to 150°C +3°C, -0°C, ±(1.0% + 0.5mQ)AR 5 cycles, minimum 15 min. at each extreme Short-time overload Overload voltage 5x rated wattage for 5 sec. ±(0.5% + 0.5mQ)AR Solderability Bath temp. 260°C ±5°, immersion time 5 sec. ±0.5, JIS C 5201 >90% of contact face Resistance to solder Bath temp. 260°C ±5°, immersion time 5 sec. ±0.5, JIS C 5201 ±(0.5% + 0.5mQ)AR heat 4.18 Dielectric withstanding Magnitude of test voltage >500 volts rms.; duration 1 min. Pass voltage...