Overview

The 253 Series from Ohmite provides board-level heat sinks designed specifically for TO-220, TO-218, and Multiwatt electronic components. These heat sinks are intended to improve thermal dissipation and enhance component reliability in electronic assemblies.

Specifications

• Compatibility: Suitable for TO-220, TO-218, and Multiwatt package types.
• Design: Compact, board-mountable heat sinks optimized for efficient heat transfer.
• Material: Typically constructed from thermally conductive metals (exact material details not provided in the excerpt).

Applications

These heat sinks are ideal for use in power electronics where thermal management is critical, such as power supplies, amplifiers, and motor controls.

Contact and Support

For further technical details, ordering information, or support, customers can contact Ohmite via phone at 1-866-9-OHMITE (US) or +1-847-258-0300 (International), fax at 1-847-574-7522, or email at [email protected]. Additional product information is available on their website www.ohmite.com.