OAI_M2000
2Pages

Edge-bead/ UV Flood Exposure Systems. The Model 2000SM can significantly reduce the particle contamination that occurs as a result of routine wafer handling. In both OAI 2000SM and 2000FL, the robot is the only significant moving part, greatly simplifying this unique system. he OAI Model 2000 may be configured as either an edge-bead exposure tool or a flood exposure system; both configurations are based on a proven, time-tested platform. The OAI 2000SM Edge-bead Exposure System provides a cost-effective method for edge-bead exposure using standard shadow mask technology. Mask and substrate changeover can be accomplished quickly and easily adding to the versatility as well as throughput of this high volume production tool. Advantages In terms of simplicity, versatility, ease of operation and overall cost of ownership, the OAI Edge-bead and Flood Exposure Systems are by far the best solution available. Model 2000FL Flood Exposure System: I Throughput is independent of pattern complexity. I Entire substrate is exposed at one time. I Intensity-controlling power supply. Model 2000SM Edge-bead System: I Changing the exposure pattern is as simple as changing the shadow mask. I Changeover (including mask alignment) requires only ten minutes. The Model 2000 includes a UV lightsource, intensity controlling power supply, and robotic substrate handling subsystem. UV lightsources provide uniform intensity beams with divergence half-angles of <2.0º. Power supplies are available from 200W to 5,000W. Intensity controller OAI Model 2000 sensors are linked directly to the lightsource for Edge-bead and UV Flood accurate intensity monitoring. The OAI robotic Exposure System substrate handling system is microprocessor controlled and may be programmed to accommodate a wide variety of substrate sizes. The shadow mask capability enables the user to pattern the top-side of a substrate while being held in very close proximity to the mask. At a separation of 25 microns, these systems are capable of 6 micron resolution. 2000FL Flood Exposure Systems are used to augment and/or enhance the photolithography processes in both production and R&D settings. Applications include photoresist stabilization and modification, image reversal and PCM processes.

Exposure Beam Size UP TO 300mm diameter Beam Divergence < 2.0° (1/2 angle) Beam Spectrum Near UV, Mid UV, Deep UV Shutter Controller Control Functions EXPOSE, TEST Constant Intensity Power Supplies Near UV/Mid UV/Deep UV Power Regulation Better than ±0.5% Intensity Control Dual channel optical feedback loop with ±2% precision and long term repeatability Control Systems Dual channel System Alarm Audible Maximum Power Warning Substrate Handling System Type Robotic Substrate Transfer Cassette-to-cassette Handling Vacuum arm (end effector) Flat Orientation ±1 degree *FOUP loader available on...