Model 6000 Mask Aligner
Model 6000 Mask Aligner
- Automation: Fully automated cassette to cassette system.
- Resolution: Sub-micron resolution with advanced beam optics ensuring better than ±3% uniformity.
- Throughput: Capable of processing 180 wafers per hour in first mask mode.
- Wafer Handling: Supports a wide range of wafers, including thick, bonded, warped, and thin substrates.
- Alignment: Offers topside and optional backside alignment using CognexTM Pattern Recognition software.
- Integration: Seamlessly integrates with cluster tools for a complete lithography process.
- Exposure Modes: Vacuum contact, hard contact, soft contact, and proximity with varying resolutions.
- Beam Optics: Uniform beam size ranging from 50mm to 300mm, with dual IMP cameras for expanded depth of field.
- Alignment Accuracy: 0.5µ topside and 1.0µ with optional backside alignment.
- Wafer Handling: Supports substrate sizes from 50mm to 300mm, with capabilities for handling thin and warped wafers.
- Options: Includes IR auto-align, cassette mapping, LED exposure light source, temperature-controlled wafer chuck, and more.
Catalog excerpts
For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging « HIGHLY OPTIMIZED YIELDS 180 WPH in 1st Mask Mode Advanced Beam Optics with better than ±3% Uniformity WIDE VARIETY OF WAFER HANDLING Including thick & bonded substrates and warped substrates WEDGE EFFECT LEVELING SUPERB PROCESS REPEATABILITY SUB MICRON RESOLUTION With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment. Built on the venerable OAI modular platform, the Series 6000 is a fully automated cassette to cassette system with sub-micron resolution which delivers performance that is unmatched at any price. The aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafer per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist. With superb process repeatability, the Series 6000 is the perfect solution for all production environments. Choose either top side or optional back side alignment which uses Cognex™ Pattern Recognition software with OAI’s pattern assist software. This unique software improves total throughput. For the total lithography process, the Series 6000 can be integrated seamlessly with cluster tools. OAI’s new production mask aligners are the total package. www.oainet.com Fully Automated Topside Alignment Bottomside Alignment DUV to NUV Cluster Tool Integration Customized Software
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Specifications: OAI Series 6000 Mask Aligner System Proximity (20j gap) 3.0|j Exposure System Exposure Modes Vacuum contact Hard contact Soft contact Uniform Beam Size: 50mm -200mm square/round 200mm -300mm square/round Uniformity: Better than ±3% Camera: Dual IMP Camera with Expanded Depth of Field Alignment System Pattern Recognition Alignment Accuracy Pre-alignment Accuracy Auto-alignment Wafer Handling Substrate size Thin wafers Warped Wafers Thick & Bonded Substrates Robotics Run-out compensation Wafer size conversion Throughput Wedge Effect Leveling Cognex VisionPro™ with...
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