ESD protection for high-speed interfaces PUSB2X4D
11Pages

{{requestButtons}}

Catalog excerpts

ESD protection for high-speed interfaces  PUSB2X4D - 1

PUSB2X4D ESD protection for high-speed interfaces Rev. 1 — 5 November 2013 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD). The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to 12 kV contact according to IEC 61000-4-2, level 4. 1.2 Features and benefits System ESD protection for USB 2.0 All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 12 kV according to IEC 61000-4-2, level 4 Line capacitance of 0.85 pF maximum for each channel 1.3 Applications The device is designed for receiver and transmitter port protection in: Portable devices TVs, monitors DVD recorders and players Notebooks, mother boards, graphic cards and ports Set-top boxes and game consoles

Open the catalog to page 1
ESD protection for high-speed interfaces  PUSB2X4D - 2

ESD protection for high-speed interfaces 2. Pinning information Table 1. 3. Ordering information Table 2. Ordering information Type number Package Name plastic surface-mounted package; 6 leads Marking codes Type number Marking code 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol input voltage electrostatic discharge voltage contact discharge pins 1, 3, 4 and 6 to ground; IEC 61000-4-2, level 4 Product data sheet ambient temperature storage temperature All information provided in this document is subject to legal...

Open the catalog to page 2
ESD protection for high-speed interfaces  PUSB2X4D - 3

ESD protection for high-speed interfaces 6. Characteristics Table 5. Characteristics Tamb = 25 C unless otherwise specified. Symbol breakdown voltage reverse leakage current forward voltage negative transient line capacitance positive transient line capacitance difference dynamic resistance positive transient negative transient TLP clamping voltage Product data sheet According to IEC 61000-4-5 (8/20 s current waveform). This parameter is guaranteed by design. 100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns. All information provided in this document is subject to legal disclaimers.

Open the catalog to page 3
ESD protection for high-speed interfaces  PUSB2X4D - 4

ESD protection for high-speed interfaces Insertion loss; typical values Crosstalk; typical values aaa-009807 Relative capacitance as a function of input voltage; typical values Product data sheet All information provided in this document is subject to legal disclaimers.

Open the catalog to page 4
ESD protection for high-speed interfaces  PUSB2X4D - 5

ESD protection for high-speed interfaces Dynamic resistance with positive clamping; typical values Dynamic resistance with negative clamping, typical values tp = 100 ns; Transmission Line Pulse (TLP) tp = 100 ns; Transmission Line Pulse (TLP) Dynamic resistance with positive clamping, typical values Dynamic resistance with negative clamping; typical values The device uses an advanced clamping structure, which shows a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited...

Open the catalog to page 5
ESD protection for high-speed interfaces  PUSB2X4D - 6

ESD protection for high-speed interfaces Product data sheet All information provided in this document is subject to legal disclaimers.

Open the catalog to page 6
ESD protection for high-speed interfaces  PUSB2X4D - 7

ESD protection for high-speed interfaces solder lands solder resist solder paste occupied area 0.7 (6×) Reflow soldering footprint SOT457 (SC-74) 5.3 solder resist occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 Fig 10. Wave soldering footprint SOT457 (SC-74) Product data sheet All information provided in this document is subject to legal disclaimers.

Open the catalog to page 7
ESD protection for high-speed interfaces  PUSB2X4D - 8

ESD protection for high-speed interfaces 9. Revision history Table 6. Revision history Release date Data sheet status Change notice Product data sheet Product data sheet All information provided in this document is subject to legal disclaimers.

Open the catalog to page 8
ESD protection for high-speed interfaces  PUSB2X4D - 9

ESD protection for high-speed interfaces 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet This document contains data from the objective specification for product development. Preliminary [short] data sheet This document contains data from the preliminary specification. Product [short] data sheet This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in...

Open the catalog to page 9
ESD protection for high-speed interfaces  PUSB2X4D - 10

ESD protection for high-speed interfaces Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the...

Open the catalog to page 10
ESD protection for high-speed interfaces  PUSB2X4D - 11

ESD protection for high-speed interfaces Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics...

Open the catalog to page 11

All NXP Semiconductors catalogs and technical brochures

  1. TEF668X

    8 Pages

  2. TDA8034HN

    32 Pages

  3. MSC8256

    70 Pages

  4. SAC57D54H

    77 Pages

  5. OL2385

    85 Pages

  6. MAC57D5xx

    2 Pages