BZB100A Bidirectional Zener diode
10Pages

BZB100A Bidirectional Zener diode Rev. 02 — 24 June 2008 Product data sheet 1. Product prole 1.1 General description Bidirectional Zener diode in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I I Non-repetitive peak reverse power dissipation: PZSM ≤ 30 W Bidirectional conguration Small plastic package suitable for surface-mounted design AEC-Q101 qualied 1.3 Applications I General regulation functions I Overvoltage protection for ElectroLuminescent (EL) driver circuits 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions VZ working voltage IZ = 1 mA IZSM non-repetitive peak reverse current Min Typ Max Unit 95 - 105 V - - 0.23 A Per device [1] [1] tp = 100 µs; square wave; Tj = 25 °C prior to surge 2. Pinning information Table 2. Pinning Pin Description 1 cathode (diode 1) 2 cathode (diode 2) Simplied outline 1 2 Graphic symbol 1 2 006aab041

BZB100A NXP Semiconductors Bidirectional Zener diode 3. Ordering information Table 3. Ordering information Type number Package Name Version SC-76 BZB100A Description plastic surface-mounted package; 2 leads SOD323 4. Marking Table 4. Marking codes Type number Marking code BZB100A AT 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per device IZSM non-repetitive peak reverse current [1] - 0.23 A PZSM non-repetitive peak reverse power dissipation [1] - 30 W [2] - 75 W [3] - 300 mW [4] - 540...

BZB100A NXP Semiconductors Bidirectional Zener diode 006aab042 1.0 Ptot (W) (1) 0.8 0.6 (2) 0.4 (3) 0.2 0 −75 −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for cathode 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit [1] - - 415 K/W [2] - - 230 K/W [3] - - 150 K/W [4] - - 90 K/W Per device Rth(j-a) Rth(j-sp) thermal resistance from junction to solder point [1]...

BZB100A NXP Semiconductors Bidirectional Zener diode 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specied. Symbol Parameter Conditions Min Typ Max Unit VZ working voltage IZ = 1 mA 95 - 105 V rdif differential resistance IZ = 1 mA - - 700 Ω IR reverse current VR = 76 V - - 0.05 µA SZ temperature coefcient IZ = 1 mA - 123 - mV/K Cd diode capacitance f = 1 MHz; VR = 0 V - - 10 pF Per device 006aab043 103 006aab044 150 SZ (mV/K) PZSM (W) 140 102 130 120 10 110 1 10−5 10−4 10−3 10−2 100 0 1 2 tp (s) 5 Tj = 25 °C to 150 °C Non-repetitive peak reverse power dissipation...

BZB100A NXP Semiconductors Bidirectional Zener diode 006aab045 10−2 IZ (A) 10−3 10−4 10−5 10−6 10−7 10−8 10−9 80 90 100 110 120 VZ (V) Tj = 25 °C Fig 4. Working current as a function of working voltage; typical values 8. Application information High-voltage Zener diodes can be used as overvoltage protection diodes for Integrated Circuits (IC) due to their ability to cut off the applied voltage at a well-dened value. One important application is the protection of EL driver circuits where a driver IC is connected to an EL foil. Since both the foil as well as the IC are sensitive against...

BZB100A NXP Semiconductors Bidirectional Zener diode 9. Test information 9.1 Quality information This product has been qualied in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualication for discrete semiconductors, and is suitable for use in automotive applications. 10. Package outline 1.35 1.15 1.1 0.8 0.45 0.15 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm Fig 6. 0.25 0.10 03-12-17 Package outline SOD323 (SC-76) 11. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number...

BZB100A NXP Semiconductors Bidirectional Zener diode 12. Soldering 3.05 2.1 solder lands solder resist 0.5 (2×) 1.65 0.95 0.6 (2×) solder paste occupied area 2.2 Dimensions in mm 0.5 (2×) 0.6 (2×) Fig 7. sod323_fr Reow soldering footprint SOD323 (SC-76) 5 2.9 1.5 (2×) solder lands solder resist occupied area 2.75 1.2 (2×) Dimensions in mm preferred transport direction during soldering sod323_fw Fig 8. Wave soldering footprint SOD323 (SC-76) BZB100A_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 24 June 2008 7 of 10

BZB100A NXP Semiconductors Bidirectional Zener diode 13. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BZB100A_2 20080624 Product data sheet - BZB100A_1 - - Modications: BZB100A_1 • • • • • • • Section 1.1 “General description”: adapted Section 1.2 “Features”: adapted Table 2 “Pinning”: graphic symbol amended Table 6 “Thermal characteristics”: updated Section 8 “Application information”: adapted Section 12 “Soldering”: updated Section 14 “Legal information”: updated 20080128 Product data sheet BZB100A_2 Product data sheet ©...

BZB100A NXP Semiconductors Bidirectional Zener diode 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Denition Objective [short] data sheet Development This document contains data from the objective specication for product development. Preliminary [short] data sheet Qualication This document contains data from the preliminary specication. Product [short] data sheet Production This document contains the product specication. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is...

BZB100A NXP Semiconductors Bidirectional Zener diode 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product prole . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . ....