DISCRETE SEMICONDUCTORS DATA SHEET M3D184 BZA100 18-fold ESD transient voltage suppressor Product data sheet Supersedes data of 1996 Mar 21 1997 Dec 02

NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor BZA100 FEATURES DESCRIPTION • SO20 SMD package allows 18 separate voltage regulator diodes in a common anode configuration 18-fold monolitic transient voltage suppressor. Its 18-fold junction common anode design protects 18 separate lines using only one package. This device is ideal for situations where board space is a premium. • Working voltage: typ. 6.8 V • Forward voltage: max. 1.3 V • Maximum reverse peak power dissipation: 27.5 W at tp = 1 ms • Maximum clamping voltage at peak pulse current: 11 V at 2.5 A PINNING...

NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor BZA100 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS thermal resistance from junction to soldering point Rth j-a UNIT 56.5 K/W 100 Rth j-s VALUE K/W MAX. UNIT thermal resistance from junction to ambient one or more diodes loaded ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. Per diode VZ working voltage IZ = 5 mA 6.4 6.8 7.2 V VF forward voltage IF = 200 mA − − 1.3 V VZSM non-repetitive peak reverse voltage tp = 1 ms; IZSM = 2.5 A − − 11 V IR reverse current...

NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor BZA100 GRAPHICAL DATA MBG393 MBG394 10 2.4 handbook, halfpage handbook, halfpage Ptot (W) IZSM (A) 1.6 1 0.8 10−1 10−1 1 10 0 10 2 t (ms) 103 p 0 50 100 Ts (oC) 150 All diodes loaded. Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Fig.3 Power derating curve. MBG395 10 2 handbook, halfpage MBG392 100 handbook, halfpage Cd (pF) PZSM (W) 80 10 60 1 10−1 1 10 40 10 2 t (ms) 103 p 0 2 4 VR (V) 6 PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Tj = 25 °C; f = 1...

NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor BZA100 PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49...

NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor BZA100 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in...

NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information...