Standards Summary for Electronics Packaging

Introduction to the Standards Summary Why is Schroff committed to standards and modular concepts? Commercial electronic devices are investments with relatively long life cycles, where high reliability and availability are predominant requirements. In order to keep the cost low and at the same time maintain a very high quality level, standard designs with predefined performance levels are indispensable. Subracks, cases and cabinets are structural parts of any equipment. The standards philosophy allows short development time and fast market introduction for these products without expensive development,...

Paul Mazura Germany Vice President Product Development and Standardisation Keith Reynolds UK Technical Manager The Schroff commitment to standards Since 1978 Schroff is actively participating in the standardisation of "Mechanical Structures for Electronics Equipment" in the global IEC organisation. As an international company with global customers we feel responsible for the progress in standardisation by implementing latest technologies and converting them into standard product platforms. Michael Thompson USA Principal Engineer Akio Shimada Japan Manager Marketing and Standardisation Members...

Standardisation Summary - a Guide Through International Standards for Electronics Packaging IEC standards The globalisation of the commercial electronics market creates a demand for internationally valid standards. Time-to-market and development expenses of an electronic device force application engineers to use off-the-shelf products rather than design proprietary packaging solutions. Recently developed Electronics Packaging standards comprise dimensional specifications and - on a higher level - the criteria for physical integrity, electromagnetic compatibility and thermal management. With regard...

Mechanical Structures for Electronics Equipment 1.00 Design guide for subracks and associated plug-in units 6 1.01 Overview of the 482.6 mm (19") standard series, IEC 60297-3-101 7 1.02 Basic subrack dimensions 8 1.03 Guide rail dimensions 9 1.06 Subrack depth mounting dimensions 12 1.07 Subrack front mounting dimensions 13 1.08 Dimensions of subrack associated plug-in units 14 1.09 Subrack/front panel shielding interface dimensions 15 1.10 Subrack/plug-in unit electrostatic discharge provisions (ESD) 16 1.11 Subrack/plug-in unit keying and alignment pin 17 1.12 Subrack dimensions for the 25...

1.00 Design Guide for subracks and associated plug-in units

1.01 Overview of the 482.6 mm (19") standard series IEC 60297-3-101 1 Board type plug-in unit 2 Box type plug-in unit 19" system dimensions and definitions Width: Depth: The width over the mounting flanges is 482.6 mm The overall width behind the mounting flanges The subrack total depth is not explicitly specified (19"), which created the term 19" system. (incl. screws) shall be max. 449 mm. The subrack by the standard. The individual dimensions aperture width is subdivided by a modular pitch of depend on the board depth, rear connector tails or 1 HP = 5.08 mm (2/10"). rear input/output plug-in...

1.02 Basic subrack dimensions First pitch line Subrack front view for 3 U, 6 U and 9 U Printed board Guide rail Note: The height dimension 100.2 + 0.5 mm is derived from the printed board height dimension and a min. tolerance of 0.2 mm. The max. tolerance of 0.2 + 0.5 = 0.7 mm includes the clearance tolerance of the subrack horizontal members. Width: 482.6 mm ± 0.4. Mounting grid for front panels: 5.08 mm. Subrack aperture: > 84 x 5.08 mm Dimensions and description of front panel height arrangements ) optional design

1.03 Guide rail dimensions , , Pitch lines Printed board thickness is in general 1.6 mm. Thicker boards are possible but need to be agreed between contracting parties. If two part connectors are used the increased thickness shall be opposite to the reference plane of the board (Ref. plane = ref. to first pitch line). 1 Guide rail for plug-in units as per IEC 60297-3-101. 2 Mirrored to version 1. Used for rear I/O or on right hand position. 3 Guide rail with off-set position (board shifted by 2.54 mm). 4 Guide rail with keying and alignment pin receptacle as per IEC 60297-3-103 (see also 1.11)....

The printed board dimensions are specified in IEC 60297-3-101. The figure below shows a typical 6 U board. Fixing points for printed board holder Ø 2,7 Table 1 Dimensions: Thickness: The printed board dimensions are defined as the The thickness of a board is, if nothing specifically Printed board base of the Eurocard form factor required 1.6 mm. Thicker boards should be agreed (H = 100 x D = 160 mm). between user and vendor with respect to the Heigth H +0/-0.3 Depth D +0/-0.3 accessories concerned, e. g. guide rails. 80 Height: IEC 60297-3-101 as the relevant standard for 19" 3 U = 100 100 The...

Figure 6a Pitch line Front view Pitch line Reference lines for fixing points of the backplanes to the subrack First position of the connectors of IEC 60603-2 and 61076-4-113 series (contact row b) First position of the connectors of IEC 61076-4-101 series The connectors of the above described IEC series fit on the backplane within the same slot width but with different reference dimensions of the contact grids to the pitch line. The contact grid in figure 6a is 2.54 mm and 2 mm in figure 6b. Typical applications for the IEC 60603-2 and IEC 61076-4-113 series are VME64 and VME64x. IEC 61076-4-101...

1.06 Subrack depth mounting dimensions Inspection dimensions for the subrack front depth D from the front attachment plane to the backplane attachment plane The formular for connectors type IEC 60603-2 and 61076-4-113 (application example VME) is the same as for connectors type IEC 61076-4-101 (application example CPCI): D = printed board depth + 15.6 (e. g. 160 + 15.6 = 175.6). Front plug-in unit Rear plug-in unit Inspection dimensions for the subrack rear Explanations for the rear arrangement of depth DR from the rear attachment plane to plug-in units the backplane attachment plane For I/O...