Wafer Testing Solutions Engineered for Excellence Nordson DAGE

2 | Wafer Testing Solutions Nordson DAGE provide a range of wafer testing solutions, Automated test provides the option of auto enabling semi-automatic handling and testing of wafers. alignment of the test head to the bumps or Auto-handling of wafers eliminates the risk associated with features to be tested, enabling high repeatability handling of fragile wafers manually, resulting in reduced testing and efficient test throughput. Once damage and contamination. programmed, the 4000W and 4300FP test The semi-automatic bond test routines provide load tool to platforms can shear...

Wafer Testing Solutions | 3 4300FP Test Platform The Nordson Dage 4300FP test platform provides semi-automatic handling and testing of wafers up to 300mm. The system comprises of a dedicated 300mm bond test platform integrated with a fully automatic wafer handler. The 4300FP supports the next generation of bond testing software, Paragon™. The highly intuitive and configurable interface provides quick and easy automated test routine development and execution for a wide range of sample configurations. A step by step wizard guides the user through the set up process, catering for a variety of options....

A Partner You Can Trust Nordson DAGE is the market leading provider of award winning test and inspection systems for destructive and non-destructive mechanical testing of electronic components. Taking pride in delivering support to multi national organisations globally. Founded in 1961, with global headquarters in Aylesbury, UK, Nordson DAGE is part of the Nordson Corporation which has direct operations in more than 30 countries. Nordson DAGE continues to invest significantly in research and development to remain at the cutting edge of test and inspection technology. Nordson DAGE are continuing...