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4800 Advanced Wafer Level Bondtesing
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Catalog excerpts

4800 Advanced Wafer Level Bondtesing - 1

4800 Bondtester Advanced Automated Wafer Testing Nordson DAGE

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4800 Advanced Wafer Level Bondtesing - 2

2 | Nordson DAGE 4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Utilizing proven technology, accuracy, repeatability, results stability combined with the latest Paragon™ automation software delivering the most advanced bondtester on the market, the Nordson DAGE 4800 is a truly unique bondtester. Nordson DAGE 4800 Bondtester | 3 Superior Accuracy Unsurpassed accuracy and repeatability ensures there is total confidence in product quality. Advanced Imaging A range of powerful camera and optical...

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4800 Advanced Wafer Level Bondtesing - 3

4 | Nordson DAGE 4800 Bondtester Nordson DAGE 4800 Bondtester | 5 Pedigree in Automated Bondtesting Nordson DAGE has vast experience of Integrated Wafer Handling Successfully Test Warped and Thin Wafers Intelligent and Intuitive Chuck Controller automated bond testing. The 4800 system Integration with a wafer handler transforms the Nordson DAGE 4800 into a fully automated system ensuring reliable and repeatable operation. This integration provides several benefits including the automated loading of warped, thin or bowed wafers. The system also supports multiple wafer sizes subject to...

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4800 Advanced Wafer Level Bondtesing - 4

6 | Nordson DAGE 4800 Bondtester Nordson DAGE 4800 Bondtester | 7 Industry Leading Technology Unparalleled Versatility Unique Dual Microscope Mount Powerful Optical Systems The unique industry leading multi-function cartridges expand the versatility of the 4800 bondtester. The 4800 bondtester’s advanced optics combined with the microscope’s dual vibration reduction mount and adjustable eye-line, provides unparalleled image stability. The 4800 system offers a range of optical solutions: A range of multi-function cartridges are available. Please consult the factory for transducer...

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4800 Advanced Wafer Level Bondtesing - 5

Note: Confidential preliminary specification only and subject to change without notice A Partner You Can Trust Nordson DAGE is the market leading provider of award winning test and inspection systems for destructive and non-destructive mechanical testing of electronic components and are experts in small geometry testing, taking pride in delivering support to multinational organisations globally. Founded in 1961, with global headquarters in Aylesbury, UK, Nordson DAGE is part of the Nordson Corporation, which has direct operations in more than 30 countries. Service and Support Our service...

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