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4800 Advanced Wafer Level Bondtesing

4800 Advanced Wafer Level Bondtesing

4800 Advanced Wafer Level Bondtesing

Product catalog summary
Overview
The Nordson DAGE 4800 Bondtester is an advanced automated system designed for wafer testing, accommodating wafers from 200mm to 450mm. It integrates cutting-edge technology with Paragon™ automation software to ensure high accuracy, repeatability, and stability in test results.

Key Features
  • Integrated Wafer Handling: The system includes a wafer handler for reliable and repeatable operations, supporting multiple wafer sizes and ensuring secure placement of warped or thin wafers.
  • Advanced Imaging: Equipped with powerful camera and optical systems for optimized load tool alignment, auto programming, and post-test analysis.
  • Automated Testing: Features include wafer handling chuck options, wafer map creation, camera-assisted fiducial bondtesting, and failure mode assignment.
  • Flexible Wafer Map Creation: Paragon™ software allows for flexible wafer map creation with virtual images for easy editing and precise setup.
  • Unique Dual Microscope Mount: Provides high power optics and vibration reduction for unparalleled image stability.

Technical Specifications
  • Size: 1075 x 980 x 855 mm (excluding PC)
  • Weight: 170 Kg
  • Power Supply: 90 - 264V AC, 47 - 63 Hz, Single Phase
  • Pneumatic Supply: Minimum 4 bar
  • Vacuum Supply: Minimum 67kPa
  • Interfaces: USB2, Gigabit Ethernet
  • XY Stage Travel: 550mm X, 410mm Y
  • Z Axis Travel: 75mm
  • System Accuracy: +/- 0.10% of selected load range

Compliance and Standards
  • ISO 9001:2008
  • CE Declaration of Conformity
  • Machinery Directive (2006/42/EC)
  • Low Voltage Directive (2006/95/EC)
  • EMC Compatibility (2004/108/EC)
  • RoHS (2002/95/EC)

Service and Support
Nordson DAGE offers comprehensive support services to ensure optimal performance of the 4800 Bondtester throughout its lifecycle, with a focus on minimizing inconvenience and cost.

Conclusion
The Nordson DAGE 4800 Bondtester is a versatile and reliable solution for automated wafer testing, offering advanced features and compliance with industry standards to meet the needs of global organizations.
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Catalog excerpts

4800 Advanced Wafer Level Bondtesing-1

4800 Bondtester Advanced Automated Wafer Testing Nordson DAGE

 Open the catalog to page 1
4800 Advanced Wafer Level Bondtesing-2

2 | Nordson DAGE 4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Utilizing proven technology, accuracy, repeatability, results stability combined with the latest Paragon™ automation software delivering the most advanced bondtester on the market, the Nordson DAGE 4800 is a truly unique bondtester. Nordson DAGE 4800 Bondtester | 3 Superior Accuracy Unsurpassed accuracy and repeatability ensures there is total confidence in product quality. Advanced Imaging A range of powerful camera and optical systems...

 Open the catalog to page 2
4800 Advanced Wafer Level Bondtesing-3

4 | Nordson DAGE 4800 Bondtester Nordson DAGE 4800 Bondtester | 5 Pedigree in Automated Bondtesting Nordson DAGE has vast experience of Integrated Wafer Handling Successfully Test Warped and Thin Wafers Intelligent and Intuitive Chuck Controller automated bond testing. The 4800 system Integration with a wafer handler transforms the Nordson DAGE 4800 into a fully automated system ensuring reliable and repeatable operation. This integration provides several benefits including the automated loading of warped, thin or bowed wafers. The system also supports multiple wafer sizes subject to specification....

 Open the catalog to page 3
4800 Advanced Wafer Level Bondtesing-4

6 | Nordson DAGE 4800 Bondtester Nordson DAGE 4800 Bondtester | 7 Industry Leading Technology Unparalleled Versatility Unique Dual Microscope Mount Powerful Optical Systems The unique industry leading multi-function cartridges expand the versatility of the 4800 bondtester. The 4800 bondtester’s advanced optics combined with the microscope’s dual vibration reduction mount and adjustable eye-line, provides unparalleled image stability. The 4800 system offers a range of optical solutions: A range of multi-function cartridges are available. Please consult the factory for transducer combinations....

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4800 Advanced Wafer Level Bondtesing-5

Note: Confidential preliminary specification only and subject to change without notice A Partner You Can Trust Nordson DAGE is the market leading provider of award winning test and inspection systems for destructive and non-destructive mechanical testing of electronic components and are experts in small geometry testing, taking pride in delivering support to multinational organisations globally. Founded in 1961, with global headquarters in Aylesbury, UK, Nordson DAGE is part of the Nordson Corporation, which has direct operations in more than 30 countries. Service and Support Our service and...

 Open the catalog to page 5

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.