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Nordson EFD Solutions
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Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing

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Fluid Positioning & Dispensing Applications Contents Introduction Fluid Positioning & Dispensing Applications

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As consumers demand thinner, lighter, more sophisticated and durable mobile devices and wearables at a lower price, manufacturers must respond with advancements in process and equipment used to manufacture these devices at lower costs. Nordson EFD delivers precise, reliable fluid dispensing systems to aid mobile device and wearables manufacturers in advancing to meet consumer needs. Our valves, controllers, reservoirs, dispense tips, and automated dispensing systems deliver highly repeatable, consistent fluid deposits while reducing material waste, rejects, and rework. In addition, EFD...

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Fluid Positioning & Dispensing Applications Mobile Device & Wearables • Edge display seal (LCD and OLED) • End display seal (LCD and OLED) • Display/cover glass bonding and gap fill • Touch panel optical gel coating • Module/IC driver gap fill • lexible printed circuit board (FPC) F reinforcing tab • over on Glass (COG) and Indium Tin C Oxide (ITO) over coating Gap between module and IC driver General Assembly • Primer/PSA applications • Hydrophobic coating • rinted circuit board (PCB) P coating and bonding • lexible printed circuit board F (FPC) reinforcing tab • MEMS microphone assembly •...

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Fluid Positioning & Dispensing Applications Display Nordson EFD solutions provide greater precision in multiple display assembly applications. Whether bonding cover glass to LCDs and OLEDs or edge sealing and end sealing of LCDs and OLEDs, Nordson EFD solutions deliver consistent, repeatable deposits at high speeds. Mobile device and wearables manufacturers prefer EFD solutions for gap-fill applications, in addition to more specialized applications such as optical bonding and seal bonding dispensing anisotropic conductive fluids in very narrow spaces. ACP bonding seal or electrode seal...

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Fluid Positioning & Dispensing Applications Camera Module As camera modules shrink in size, manufacturers need greater accuracy when bonding lenses to barrels, barrels to camera modules, camera modules to circuitry, and camera module holders to smart phone bodies. The slightest overspray bonds components that should not be bonded, creating more rework, which slows production and lowers yield. Nordson EFD solutions feature built-in cutoff functionality, in addition to extreme deposit accuracy, to eliminate overspray. Other applications utilizing EFD dispensing solutions include, but are not...

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Fluid Positioning & Dispensing Applications Microspeaker Whether bonding microspeaker membranes or lids to assembly modules, manufacturers need equipment to dispense deposits as small as 0.8 mg with extreme accuracy. Nordson EFD’s PICO jet dispensing solutions deliver continuous operation at up to 1000 cycles per second (Hz) with shot sizes starting at 0.5 nanoliters. Recommended Solutions • PICO jet valve • PICO jet valve (with needle adapter) • 741MD-SS MicroDot needle valve • xQR41 Series needle valve • PRO4 Series automated dispensing system Benefits: Better process control and...

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Fluid Positioning & Dispensing Applications General Assembly Hydrophobic Coating Nordson EFD solutions enable the precise application of hydrophobic coatings to select areas of mobile devices and wearables during final assembly. With consistent, uniform micro spray patterns, these Low Volume Low Pressure solutions prevent water ingress. Liquid droplets fly off critical components such as speakers and microphones, eliminating damage, which improves the reliability of the final product. This enhances durability of the device components for long-lasting use during their life term. Recommended...

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Fluid Positioning & Dispensing Applications General Assembly Primers Primer applications increase the adhesion of different subassemblies, e.g. volume and power button components, to pressure sensitive adhesives (PSAs). This makes components more durable and able to endure multiple clicks by users. Primers are highly volatile solvents and are difficult to handle and dispense. Nordson EFD’s expertise in precise fluid dispensing allows manufacturers to dispense accurate amounts of these functional fluids in constrained and miniaturized areas. Uniform coating that results due to dispensing...

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Fluid Positioning & Dispensing Applications General Assembly Conformal Coating For precise, micro-spray applications of conformal coatings, the 787MS spray valve uses Low Volume Low Pressure (LVLP) technology to apply a fine, controlled mist onto microchip leads on the main printed circuit boards of mobile and wearable devices. When paired with a spray valve controller, which has a post-atomizing feature for clean spray cycle finish, the system produces practically no over-spray or mist. The valve system works best when fully integrated with a 3-axis E Series automated dispensing system,...

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Fluid Positioning & Dispensing Applications General Assembly Thermal Compounds Both the 725DA piston valve and 794 auger valve are ideal for thermal compound applications because of their superior ability to dispense precise amounts of high-viscosity sticky and stringy fluids. Together with a ValveMate™ valve controller, these systems apply accurate, repeatable amounts of thermal compounds onto heat sinks for central processing units (CPUs) and memory chips. Each valve system works best when fully integrated with a 3-axis E Series automated dispensing system, which features an intuitive...

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Fluid Positioning & Dispensing Applications General Assembly Solder Paste Nordson EFD solder pastes are used in a number of mobile device and wearables manufacturing processes including soldering RF shields onto MEMS microphones and printed circuit boards. With a large variety of standard and custom halide-free, lead-free formulations, EFD provides solutions for nearly every solder paste dispensing need. Recommended Solutions • SolderPlus® dispensing solder paste* • 794 Series auger valve Benefits: Dispense flux technology leader, specialized formulations, synergy between solder paste and...

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