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SolderPlus > Solder Paste > ? Highest quality standards in the industry ? Formulated for consistent top-to-bottomdispensing? Reliable process control to increase throughput andfirst-pass yield? Less than 0.2mm microdot capability ? Easy to automate ? Custom packaging available ? Specialized formulations FluxPlus Ι Paste Flux FluxPlus > Paste Flux > ? Specialized flux formulations designed for your process? Paste flux stays where you put it for precise reflow ? Easy rework ? Micro-BGA printing formulations ? Increased control, less mess Building technical partnerships with our customers > ? Personal...

ColorGaugeInner Dia.Outer Dia. inchmminchmm Olive 14 .0601.54.0721.83 > II ≥ 21 ga.75-45-200+3250.80/0.0300.65/0.0250.65/0.025 Amber 15 .0531.36.0651.65 > III բɥ 23 ga.45-25-325+5000.50/0.0200.50/0.0200.50/0.020 Grey 16 .0471.19n/an/a > IV բɥ 25 ga.38-25-400+5000.30/0.0120.30/0.0120.30/0.012 V բɥ 27 ga.25-20-500+6350.25/0.0100.20/0.0080.15/0.006 Green 18 .0330.84.0501.27 > VI բɥ 32 ga.15-5NA0.10/0.0040.10/0.0040.05/0.002 Pink 20 .0240.61.0360.91 Purple 21 .0200.51.0320.82 Blue 22 .0160.41.0280.72 Orange 23 .0130.33.0250.65 Red 25 .0100.25.0200.52 Clear 27 .0080.20.0160.42 Lavender 30 .0060.15.0120.31...

No Clean (NC) Consists of rosin, solvent, and a small amountof activator. NC flux has low activity and is suited to easilysolderable surfaces. NC residue is clear, hard, non-corrosive, non-conductive, and designed to be left on your assembly.Residue may be removed with an appropriate solvent. > Difficult to Solder Surfaces ֖ Dispensing and Printing Degradation of a metal surface caused by an attack by oxygen.The result is a more difficult to wet surface. General Purpose Dispensing and Printing Suitable for the majority of applications not requiring additionalflux features to make a quality solder...

ProcessMate > 3000 Linear Axis Workstation ProcessMate > ٮ 2400 Air Dispensing > TT DispensingSolder Paste With Auger ValveUltra > Ι 6500 Temperature Control Unit ProcessMate > 6100 Hot AirReflow System Ultra >