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PART NO. NF2W757HT-V2H5

PART NO. NF2W757HT-V2H5

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PART NO. NF2W757HT-V2H5

Product catalog summary

Specifications for White LED

Part Number: NF2W757HT-V2H5
Features: Pb-free Reflow Soldering, ESD Withstand Voltage Class 3B, RoHS Compliant
Usage: General illumination only; not suitable for obstruction, emergency, medical, display, and machine vision applications.

Absolute Maximum Ratings

Forward Current: 180 mA
Pulse Forward Current: 240 mA
ESD Withstand Voltage: 8 kV
Operating Temperature: -40 to 100°C
Junction Temperature: 120°C

Initial Electrical/Optical Characteristics

Forward Voltage: 2.71 V at 65 mA
Luminous Flux: 37.5 lm at 65 mA
Thermal Resistance: 11-17 °C/W

Color Ranks

Color Temperature Ranges: 2700K to 6500K
Chromaticity coordinates are defined within MacAdam ellipses.

Soldering Recommendations

Reflow Soldering: Max 260°C, not more than twice
Hand Soldering: Max 350°C, not more than once
Use nitrogen atmosphere for reflow to prevent optical degradation.

Packaging

Reel Size: 4000 pcs
Moisture-proof packaging with desiccants

Derating Characteristics

Graphs provided for allowable forward current vs. temperature.

Optical Characteristics: Detailed optical characteristics for the NF2W757H-V2H5 LED include spectrum, relative illuminance, and directivity for different color temperatures (3000K and 5000K). Data is presented in graphs and is for reference only.

Forward Current and Temperature Characteristics: Graphs show the relationship between forward current, forward voltage, junction temperature, and relative luminous flux for LEDs with color temperatures ranging from 2700K to 6500K.

Reliability Tests: Various tests include resistance to soldering heat, solderability, temperature cycling, moisture resistance, and operating life under different conditions, following JEITA standards with no failures reported.

Storage and Handling: Specifies storage conditions before and after opening the aluminum bag, emphasizing moisture control. Handling precautions include avoiding direct contact with bare hands and minimizing mechanical stress during PCB assembly.

Design Considerations: Recommendations for PCB design to minimize mechanical stress on LEDs during assembly and depaneling. Warns against the effects of volatile organic compounds on LED performance in sealed environments.

Specifications and Procedures

Optical Evaluation: Conduct a light-up test under actual conditions to ensure no issues arise.
LED Characteristics: Design, assembly, and usage conditions affect LED characteristics like chromaticity and color rendering index. Verification is necessary to prevent deviations.

Electrostatic Discharge (ESD)

Sensitivity: LEDs are sensitive to excessive voltages like ESD and lightning surges.
Protection Measures: Use grounded equipment, ESD materials, and ensure proper system design.
Inspection: Perform a characteristics inspection to detect ESD damage.

Thermal Management

Temperature Control: Do not exceed the Absolute Maximum Junction Temperature (TJ).
Calculations: Use provided equations to calculate LED temperature.

Cleaning

Cleaning Agents: Avoid water or solvents like benzine; use isopropyl alcohol (IPA) instead.
Surface Care: Do not wipe the emitting surface without verification.

Eye Safety

International Specifications: Adhere to IEC 62471:2006 for photobiological safety.
Health Considerations: Avoid designs that emit flashing lights.

Miscellaneous

Warranty: Nichia provides a one-year warranty with specific conditions for replacement.
Usage Limitations: LEDs are not intended for safety-critical applications.
Intellectual Property: Nichia reserves all rights to the specification content.
Specification Agreement: Official specifications must be agreed upon in writing before launching programs.

Catalog excerpts

NICHIA CORPORATION • Pb-free Reflow Soldering Application • ESD Withstand Voltage (HBM) Class 3B • RoHS Compliant

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• This LED is only for general illumination use. However, do not use this LED for obstruction, emergency, medical, display, and machine vision applications, since these ones are not included in general illumination. * Characteristics at TJ=25°C and measured in pulse mode. * Optical Characteristics as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * Rsjs is measured using the Dynamic Mode detailed in JESD51-1. * Re:s is the thermal resistance from the junction to the Ts measurement point. (Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm)...

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Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point

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* Ranking at Tj=25°C and measured in pulse mode. * Forward Voltage Tolerance: ±0.05V * Luminous Flux Tolerance: ±5% * Color Rendering Index Ra Tolerance: ±1.5 * Color Rendering Index R9 Tolerance: ±3 * Chromaticity Coordinate Tolerance: ±0.003 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. Definition of the MacAdam ellipse ranks:

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CHROMATICITY DIAGRAM 0.34 黒体放射軌跡 Blackbody Locus 0.32 0.35

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CHROMATICITY DIAGRAM 0.32 黒体放射軌跡 Blackbody Locus

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OUTLINE DIMENSIONS Part No. NF2W757Hx No. STS-DA7-16040A * 本製品はRoHS指令に適合しております。 This product complies with RoHS Directive. * 括弧で囲まれた寸法は参考値です。 The dimension(s) in parentheses are for reference purposes. 光学的中心位置 Location of the optical center Cathode Mark パッケージ材質 Package Materials 電極材質 Electrodes Materials 耐熱性ポリマー Heat-Resistant Polymer シリコーン樹脂（拡散剤+蛍光体入り） Silicone Resin (with diffuser and phosphor) 銅合金+銀メッキ Ag-plated Copper Alloy 封止樹脂材質 Encapsulating Resin Materials

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• Recommended Reflow Soldering Condition(Lead-free Solder) • Recommended Hand Soldering Condition ^ • Recommended Soldering Pad Pattern • Recommended Metal Solder Stencil Aperture * This LED is designed to be reflow soldered to a PCB. If dip soldered, Nichia will not guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly. * During reflow soldering, the heat and atmosphere in the reflow oven may...

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NICHIA STS-DA1-6731A * If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further from where the nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs. ● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle) 吸着ノズル Pick-and-place nozzle テープ剥離位置 Tape Removal Position 製品テープ Top Cover Tape キャリアテープ引き出し方向 Feed Direction...

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TAPE AND REEL DIMENSIONS (0.02 クロスバー凹部) (0.02 Crossbar Recess) Cathode Mark テーピング部 Tape 3.18±0.1 エンボスキャリアテープ Embossed Carrier Tape トレーラ部/リーダ部 Trailer and Leader トップカバーテープ Top Cover Tape 引き出し方向 Feed Direction LED装着部 Loaded Pockets トレーラ部最小160mm（空部） Trailer 160mm MIN(Empty Pockets) 引き出し部最小100mm（空部） Leader with Top Cover Tape 100mm MIN(Empty Pocket) リーダ部最小400mm Leader without Top Cover Tape 400mm MIN

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PACKAGING - TAPE & REEL Part No. Nxxxxxxx No. STS-DA7-17527 Reels are shipped with desiccants in heat-sealed moisture-proof bags. シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。 Label ラベル Desiccants シリカゲル Seal 熱シール NIC HIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture-proof bags are packed in cardboard boxes with corrugated partitions. アルミ防湿袋を並べて入れ、ダンボールで仕切ります。 Label ラベル TriG ai n® Technol ogy NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN * ******* is the customer part number. If not provided, it will not be indicated on the label. 客先型名を*******で示します。客先型名が設定されていない場合は空白です。...

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Lot Number is presented by using the following alphanumeric code. xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Color Rendering Index

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DERATING CHARACTERISTICS Part No. NF2x757x No. STS-DA7-16041B Solder Temperature(Cathode Side) vs Allowable Forward Current はんだ接合部温度(カソード側)-許容順電流特性 Ambient Temperature(°C) 周囲温度 Duty Ratio vs Allowable Forward Current デューティー比-許容順電流特性 Solder Temperature(Cathode Side)(°C) はんだ接合部温度(カソード側) Allowable Forward Current(mA) Allowable Forward Current(mA) 許容順電流 Allowable Forward Current(mA) 許容順電流

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OPTICAL CHARACTERISTICS Part No. NF2W757H-V2H5 No. STS-DA7-19292 * All characteristics shown are for reference only and are not guaranteed. 本特性は参考です。 * The following graphs show the characteristics measured in pulse mode. パルス駆動により測定しています。 Spectrum 発光スペクトル Relative Emission Intensity(a.u.) (Normalized to peak spectral intensity) 相対発光強度(最大強度で正規化) Directivity 指向特性 Radiation Angle 放射角度

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OPTICAL CHARACTERISTICS Part No. NF2W757H-V2H5 No. STS-DA7-19293 * All characteristics shown are for reference only and are not guaranteed. 本特性は参考です。 * The following graphs show the characteristics measured in pulse mode. パルス駆動により測定しています。 Spectrum 発光スペクトル Relative Emission Intensity(a.u.) (Normalized to peak spectral intensity) 相対発光強度(最大強度で正規化) Directivity 指向特性 Radiation Angle 放射角度

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FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS Part No. NF2W757H-V2H5 No. STS-DA7-19294 * All characteristics shown are for reference only and are not guaranteed. 本特性は参考です。 * The following graphs show the characteristics measured in pulse mode. パルス駆動により測定しています。 Forward Voltage vs Forward Current 順電圧-順電流特性 Junction Temperature vs Forward Voltage ジャンクション温度-順電圧特性 Forward Current vs Relative Luminous Flux 順電流-相対光束特性 Junction Temperature(°C) ジャンクション温度 Junction Temperature vs Relative Luminous Flux ジャンクション温度-相対光束特性 Relative Luminous Flux(a.u.) (Normalized at TJ =25°C) 相対光束(T J =25°Cで正規化)...

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