NICHIA CORPORATION • Pb-free Reflow Soldering Application • ESD Withstand Voltage (HBM) Class 3B • RoHS Compliant

* Characteristics at Tj=25°C and measured in pulse mode. * Optical Characteristics as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * R0js is measured using the Dynamic Mode detailed in JESD51-1. * R0js is the thermal resistance from the junction to the Ts measurement point. (Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm)

Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point

Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point Color Temperature Minor Axis Major Axis Ellipse Rotation Angle (Unit: K) Center Point

* Ranking at Tj=25°C and measured in pulse mode. * Forward Voltage Tolerance: ±0.05V * Luminous Flux Tolerance: ±5% * Color Rendering Index Ra Tolerance: ±1.5 * Color Rendering Index R9 Tolerance: ±3 * Chromaticity Coordinate Tolerance: ±0.003 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. Definition of the MacAdam ellipse ranks:

Luminous Flux Ranks by Color Rank, Color Rendering Index Rank

CHROMATICITY DIAGRAM

CHROMATICITY DIAGRAM

CHROMATICITY DIAGRAM 0.32 黒体放射軌跡 Blackbody Locus

OUTLINE DIMENSIONS Part No. No. * 本製品はRoHS指令に適合しております。 This product complies with RoHS Directive. * 括弧で囲まれた寸法は参考値です。 The dimension(s) in parentheses are for reference purposes. 光学的中心位置 Location of the optical center Cathode Mark パッケージ材質 Package Materials 耐熱性ポリマー Heat-Resistant Polymer 封止樹脂材質 Encapsulating Resin Materials シリコーン樹脂 （拡散剤+蛍光体入り） Silicone Resin (with diffuser and phosphor) 電極材質 Electrodes Materials 銅合金+銀メッキ Ag-plated Copper Alloy

• Recommended Reflow Soldering Condition(Lead-free Solder) • Recommended Hand Soldering Condition ^ • Recommended Soldering Pad Pattern * This LED is designed to be reflow soldered to a PCB. If dip soldered, Nichia will not guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly. * During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade....

NICHIA STS-DA1-5838 * If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further from where the nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs. ● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle) 吸着ノズル Pick-and-place nozzle テープ剥離位置 Tape Removal Position 製品テープ Top Cover Tape キャリアテープ引き出し方向 Feed Direction...

TAPE AND REEL DIMENSIONS (0.02 クロスバー凹部) (0.02 Crossbar Recess) Cathode Mark テーピング部 Tape 3.18±0.1 エンボスキャリアテープ Embossed Carrier Tape トレーラ部/リーダ部 Trailer and Leader トップカバーテープ Top Cover Tape 引き出し方向 Feed Direction LED装着部 Loaded Pockets トレーラ部最小160mm（空部） Trailer 160mm MIN(Empty Pockets) 引き出し部最小100mm（空部） Leader with Top Cover Tape 100mm MIN(Empty Pocket) リーダ部最小400mm Leader without Top Cover Tape 400mm MIN * 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、 エンボスキャリアテープを強く(10N以上)締めないで下さい。 LEDがカバーテープに貼り付く可能性があります。 When the tape is rewound due to work interruptions, no more than 10N should be applie

PACKAGING - TAPE & REEL Reels are shipped with desiccants in heat-sealed moisture-proof bags. シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。 Desiccants シリカゲル Seal 熱シール NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture-proof bags are packed in cardboard boxes with corrugated partitions. アルミ防湿袋を並べて入れ、ダンボールで仕切ります。 Label ラベル NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN ******* is the customer part number. If not provided, it will not be indicated on the label. 客先型名を*******で示します。 客先型名が設定されていない場合は空白です。 For details, see "LOT NUMBERING CODE" in this document. ロット表記方法についてはロット番号の項を...

Lot Number is presented by using the following alphanumeric code. xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Color Rendering Index

DERATING CHARACTERISTICS Part No. NF2W757H-F1 No. STS-DA7-16041 Solder Temperature(Cathode Side) vs Allowable Forward Current はんだ接合部温度(カソード側)-許容順電流特性 Allowable Forward Current(mA) 許容順電流 Allowable Forward Current(mA) 許容順電流 Ambient Temperature vs Allowable Forward Current 周囲温度-許容順電流特性 Derating1 R θJA = 74°C/W 300 Solder Temperature(Cathode Side)(°C) はんだ接合部温度(カソード側) Ambient Temperature(°C) 周囲温度 Duty Ratio vs Allowable Forward Current デューティー比-許容順電

OPTICAL CHARACTERISTICS Part No. NF2W757H-F1 No. STS-DA7-16042 * All characteristics shown are for reference only and are not guaranteed. 本特性は参考です。 * The following graphs show the characteristics measured in pulse mode. パルス駆動により測定しています。 Spectrum 発光スペクトル Relative Emission Intensity(a.u.) (Normalized to peak spectral intensity) 相対発光強度(最大強度で正規化) Directivity 指向特性 Radiation Angle 放射角度

OPTICAL CHARACTERISTICS Part No. NF2W757H-F1 No. STS-DA7-16043 * All characteristics shown are for reference only and are not guaranteed. 本特性は参考です。 * The following graphs show the characteristics measured in pulse mode. パルス駆動により測定しています。 Spectrum 発光スペクトル Relative Emission Intensity(a.u.) (Normalized to peak spectral intensity) 相対発光強度(最大強度で正規化) Directivity 指向特性 Radiation Angle 放射角度