Stacked Film Capacitor Chips NSWC Series FEATURES NSWC IS • STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM RECOMMENDED • STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES FOR NEW DESIGNS • WIDE TEMPERATURE RANGE UP TO +125OC* • HIGH HEAT AND MOISTURE RESISTANT RoHS • VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS Compliant includes all homogeneous materials nCHARACTERISTICS • REFLOW SOLDERING ONLY *See Part Number System for Details • TAPE AND REEL PACKAGING SPECIFICATIONS Capacitance Range Votage Ratings Capacitance Tolerance Temperature Range Dissipation factor (20°C) Insulation resistance (20°C) Dielectric Withstanding Voltage 150% of Rated Voltage 60 Seconds ENVIRONMENTAL CHARACTERISTICS Life Test At +105°C 1,000 Hours at 125% of Rated Voltage (125°C for 0.012μF ~ 1.0μF) Resistance to Soldering Heat: +240°C Peak Humidity Load Life (90% ~ 95% RH) (1) 1,000 Hours, +40°C 500 Hours for 0.012μF ~ 1.0μF (2) 500 Hours, +60°C for 0.001 ~ 0.01μF Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance 90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot RECOMMENDED REFLOW PROFILE Standard: +240 °C Peak Temperature +250°C Special Order (see part numbering system) Cool Down Within +1%/-6% of Initial Value 1.1% Maximum 1 Gigohm Minimum or 300Ω/F whichever is lower Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value 1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF 1 Gigohm Minimum or 300Ω/F whichever is lower (1) +8%/-5% (2) ±10% of Initial Value (1) 1.5% Max. (2) 2.0% Max. (1) 100 Megohm Min. or 30Ω/F (2) 10 Megohm Min. or 3Ω/F whichever is lower PART NUMBER SYSTEM NSWC 823 J 100 TR D4 N F RoHS Compliant Optional High Temp. Reow (+250°C)* Size Code Tape & Reel Voltage Tolerance Code: J = ±5% Capacitance in pF, 1st two digits are signicant, 3rd digit is no. of zeros Series *Special packaging and handling required. NIC COMPONENTS CORP. www.niccomp.com SPECIFICATIONS ARE SUBJECT TO CHANGE

Stacked Film Capacitor Chips NSWC Series Part Number Fig. 2 (B2~C3) Stacked Element Terminations: 95.5% Sn, 4% Ag and 0.5% Cu over phosphorus copper barrier over copper base 95.5% Sn, 4% Ag and 0.5% Cu over phenolic resin/Ag/Ni/Cu over copper base Fig. 1 (D1~R8) Stacked Element Terminations: Specications are subject to change

Stacked Film Capacitor Chips NSWC Series EMBOSSED PLASTIC CARRIER 1.5 +0.1 -0 Specications are subject to change