Molded Chip Wirewound Inductors EIA SIZES A (1210), B (1812), C (1008) AND D (0805) EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS BOTH FLOW AND REFLOW SOLDERING APPLICABLE HIGH INDUCTANCE AVAILABLE IN SMALL SIZE EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE AVAILABLE TYPE AND RANGE Inductance Style Range 0805 D 2.0 x 1.25 x 1.25 NIN-ND Standard 10nH ~ 1.0μH NIN-FC 0.22 ~ 100μH Standard 1008 C 2.5 x 2.0 x 1.6 NIN-NC 10nH ~ 0.82μH High Frequency NIN-PC 1.0 ~ 33μH High Curret NIN-FA 0.22 ~ 220μH Standard 1210 A 3.2 x 2.5 x 2.2 NIN-NA 47nH ~ 8.2μH High Frequency NIN-PA High Current 1.0 ~ 330μH NIN-FB Standard 0.1 ~ 1000μH 1812 B 4.5 x 3.2 x 3.2 NIN-PB High Current 1.0 ~ 680μH Note: Extended values, tolerances, and enhanced versions are available please contact NIC for more details. EIA Size Size Code SPECIFICATIONS Specications Inductance Range Inductance Tolerance Operating Temperature Range Insulation Resistance Withstanding Voltage Q Factor, Self Resonant Frequency, DC Resistance, Rated DC Current and Inductance Tolerance Case Size 1008 1210 1812 10nH ~ 100μH 47nH ~ 330μH 0.10μH ~ 1000μH ±20% (M), ±10% (K), ±5% (J) ±10% (K), ±5% (J) -25°C ~ +85°C (at 100% of rated voltage) 1,000 MegOhm Min. (@ 100Vdc, Termination to Case) 250Vdc for 1 minute (Termination to Case) See Individual Product Listings ENVIRONMENTAL CHARACTERISTICS Test Solderability Humidity Soldering Effect Low Frequency Vibration Thermal Shock Low Temperature Storage High Temperature Load Life Humidity Load Life Specication 90% Min. Coverage (1) No Evidence of Damage (2) Inductance Shall Be Within ±5% of Initial Value (3) Q Factor Shall Be Within ±10% of Initial Value (1) No Evidence of Damage (2) Inductance Shall Be Within ±10% of Initial Value (3) Q Factor Shall Be Within ±10% of Initial Value Test Method & Condition After 3 Sec. Dip in +230°C Solder Pot (Post Flux) After 500 Hrs at +60°C and 90~95% RH After 5 Sec. at +260°C (5 min. 120°C Pre-Heat) After 2 Hrs per Axis, 10 ~ 55Hz, 1.5mm Amplitude After 100 Cycles (-40°C ~ +85°C) 30 Min. Each After 500 Hrs at -40°C After 500 Hrs. at +85°C with Rated DC Current After 500 Hrs at +60°C with 90~95% RH at Rated DC Current NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors EIA Size Size Code PART MARKING Inductance Tolerance (2) R indicates decimal point in μH Ex:2R7 = 2.7μH Ex:R18 = .18μH = 180nH (3) N indicates nanohenries (0.001 μH), Ex: 10N = 0.01 μH = 10nH Applicable Guidelines: 1. Recommended soldering conditions : Flow (wave): 250oC for 5 sec. max. (preheating of 120oC for 5 minutes.) Reow: 250oC for 10 sec. max., total time above 230°C is 40 sec. max. (preheating 150°C ~ 180°C/120 sec. max.) 2. Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems. 3. For mounting, it is suggested...

Molded Chip Wirewound Inductors NIN-ND SERIES D SIZE (0805) STANDARD TYPE Note: Extended values, tolerances, and enhanced versions are available please contact NIC for more details. NIC COMPONENTS CORP. www.niccomp.comlwww.lowESR.com lwww.RFpassives.com lwww.SMTmagnetics.com Specifications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com STANDARD TYPE NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com NIN-NC SERIES HIGH FREQUENCY TYPE Note: Extended values, tolerances, and enhanced versions are available please contact NIC for more details. NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com HIGH CURRENT TYPE Tolerance NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors For Quality Factor (Q) and Inductance (L) over Frequency curves NIN-FA SERIES AS 1210) STANDARD TYPE Note: Extended values, tolerances, and enhanced versions are available please contact NIC for more details. NIC COMPONENTS CORP. www.niccomp.comlwww.lowESR.com lwww.RFpassives.com lwww.SMTmagnetics.com Specifications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com HIGH FREQUENCY NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com HIGH CURRENT TYPE NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductor NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com STANDARD VALUES NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors NIN Series For Quality Factor (Q) and Inductance (L) over Frequency curves see www.RFpassives.com STANDARD VALUES NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors NIN-PB SERIES STANDARD VALUES NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change

Molded Chip Wirewound Inductors CARRIER TAPE DIMENSIONS (mm) Case Code D C A B ND FC/NC/PC FA/NA/PA FB/PB ND FC/NC/PC FA/NA/PA FB/PB RECOMMENDED LAND PATTERNS FOR FLOW AND REFLOW SOLDERING NIN Chip Land Pattern DIMENSIONS (mm) Case Code D C A B NIC COMPONENTS CORP. www.niccomp.com Specications are subject to change