aROK 8110 Datasheet
2Pages

Catalog excerpts

Intel® 8th/9th Gen Core™/Xeon® CPU + Inference Accelerator AI Powered for Autonomous and Machine Vision Main Features Rolling stock AI recognition and machine vision applications Up to 8-core Intel® 8th/9th Gen Core™/Xeon® CPU processing power 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards Ultra-fast NVMe M.2/U.2 media for high-speed multi-cameras image capture RAID 0/1/5/10 configurable for data secure and integrity 24/36 VDC input with ignition management Special fixture design avoids vibration issues with GPU and PCIe cards Functionality of WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots Compliant with EN 50155 OT4 and MIL-STD-810G for anti-vibration/ shock w/ graphics card and PCIe card installed Smart fan design with temperature-based RPMs Intel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151) Two 260-pin DDR4 SO-DMIM sockets Up to 32GB+32GB in size, 2400/2666 MHz ECC memory to support: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900 4 x 2.5” SATA 3.0 SSD/HDD (15mm height), or 3 x 2.5” SATA 3.0 SSD/ HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2) 1 x CFast (externally accessible) 1 x Full size mPCIe socket (USB 2.0, PCIe 3.0) 1 x Full size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM 1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length 3 x PCIe 3.0 x4 slot, up to 240mm in length GigE/Frame Grabber (optional) Discrete Graphics Card (optional) Up to NVIDIA® RTX 3090, 450W or more advanced in the future 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou Built-in G-sensor 2-Port independent GbE LAN, M12 X-coded 9K byte jumbo frame PTP (IEEE 1588) support Controller: Intel® i210-T1, PHY: Intel® I219-LM vPro (iAMT) & WOL support Train Computer Waterproof DC input connector with ignition for 24/36 VDC-IN Power button Reset button 6 x LED indicators for power/IGN/WLAN/WWAN/LAN status 4 x LED indicators for storage/fan control 5 x LED indicators for user to program 1 x USB 3.1 Gen2 + 1 x USB 2.0, type A 1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B) 1 x DB15 (EXT.), reserved for expansion 7 x SMA antenna holes 2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation) 2 x USB 3.1 Gen2, type A 1 x M12 A-coded connector for 2 x USB 2.0 2 x GbE (M12 X-coded) 1 x VGA + 1 x HDMI 2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation) 2 x SIM slots 1 x SMA antenna hole for GNSS 6 x SMA antenna holes 1 x PCIe x16 lane slot 3 x PCIe x4 lane slots 1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo) DI/DO (isolation) 4-Bit input -- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA) -- External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0-2 VDC 4-Bit output -- ource: 9~48V-IN (nominal 35mA@24V) S -- External: 5~27VDC pull-high, sink current w/ 220mA for eac

Open the catalog to page 1

Dimension Drawing C AN 2.0B (isolation) C ontroller: SJA1000 B it rate up to 1Mbit/s S ocket CAN supported 1 1-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2 E SD: ± 8KV/15KV (contact/air) 2 .5KV isolated Power Management 2 4/36 VDC-IN C ranking voltage: 6V~9V (< 30 seconds) R everse protection, OCP & UVP Ignition on/off control/programmable on/off delay timer Operating System -- Supply change over class C1 -- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 -- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 -- Shock and vibration IEC 61373 Class B -- Protective coating class PC1...

Open the catalog to page 2

aROK 8110 Datasheet 2Pages

Catalog excerpts

All Nexcom - Mobile Computing Solutions catalogs and technical brochures

aROK 8110 Datasheet
2Pages