aROK 5510 Datasheet
2Pages

{{requestButtons}}

Catalog excerpts

aROK 5510 Datasheet - 1

Intel® Core™ 8/9th Gen./Xeon® CPU with Rich Storage Powerful Platform for AI Application and Storage Server Main Features Intel® Coffee Lake S/Refresh 8th/9th-Gen Core™/Xeon® LGA1151 socket-type CPU 100W power consumption graphics card support Eight SIM cards + four WWAN modules support LTE/5G WWAN module support 6 x External SSD for RAID 0, 1, 5, 10 PCle 3.0 x4 NVMe 1.3 high performance SSD support EN 50155, class OT4 conformity 3 x mini-PCIe + 3 x M.2 socket expansion Smart fan design with temperature-based RPMs Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+ Rackmount platform Product Overview aROK 5510, powerful and reliable Artificial Intelligent (AI) platform, is specially designed for the rolling stock applications, such as track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection and highly-demanding on graphic performance. It is equipped with Intel® Coffee Lake S/ Refresh 8th/9th-Gen Core™/Xeon® desktop CPU, and optional discrete graphics card guarantees the graphic performance, which satisfies with most of the Automated Intelligent (AI) requirement. With dual SIM cards per modem support, it allows eight SIM cards backup each other for a better connectivity quality by software. In addition, eight SIM cards and four WWAN modules architecture can increase the bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 guarantees the safety of video data in the six external SSD. aROK 5510 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, dispatching system, transportation cellular router, video server, and video surveillance. Specifications CPU Support 8th/9th generation Intel® Core™ i7/i5/i3 / Xeon® LGA1151 socket -- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W -- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W -- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W -- Intel® Xeon® E-2278GEL, TDP 35W -- Intel® Celeron® G4900T, TDP 35W Chipset Intel® C246 platform controller hub Memory 4 x 260-pin 2400MHz DDR4 SO-DMIM sockets up to 32GB/channel (128GB for four channels) ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T Video Output Chipset Intel® UHD graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz Discrete Graphics Card (optional) Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM 3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 x external SIM GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou G Sensor (3-axis, 10-bit resolution) LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE 2-Port LAN 10GbE SFP+ (optional) 4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional) NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6 6 x 2.5” SATA external SSD (compatible with 9.5mm drive) 1 x mSATA 1 x M.2 2280/2242/2260 Key M socket for SATA 3.0 or PCle 3.0 x4 NVMe 1.3 1 x Removable SD 3.0 Train Computer

Open the catalog to page 1
aROK 5510 Datasheet - 2

Dimension Drawing 3 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 8 x Externally accessible SIM card sockets with cover 6 x 2.5” removable SSD tray (with locker) 1 x SD with cover 1 x Reset button 1 x Power button 20 x SMA antenna 2 x LAN M12 X-coded, Intel® I210/I219 (support iAMT) 10/100/1000 Mbps 1 x DB9 (AUDIO) for1 x Mic-in, 2 x Line-out 2 x DB9 (COM1/COM2) for full RS232 (isolation) 2 x DB9 (COM3/COM4) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) -- 1 x Isolated CAN Bus 2.0B -- 4 x DI and 4 x DO (isolation) -- Power in for DIO isolation, 9~48VDC 1 x...

Open the catalog to page 2

All Nexcom - Mobile Computing Solutions catalogs and technical brochures

  1. MVS 5600-IPK

    2 Pages