QuikLaze 50ST2 is a tool designed specifically for quick, easy removal of a variety of materials. Multiple, user se-lectable wavelengths provide the capability to selectively remove certain materials while leaving others unaffected. A few examples of procedures that can be efficiently per-formed include: Remove ITO shortscut metal traces on LCD panels Remove polyimide prior to FIB edits > QuikLaze50ST2 shown with motorized micromachining accessory kit. IR Energy used to make a 15 x 110 um cut in an Indium Tin Oxide line (left image). UV used for polyimide removal of a 40 um x 40 um area (right image). Precise cutting on a microscopic level. Fast throughput using selectable repetition rates from single shot to 50 Hz continuous. Compact laser-head design for mounting on a micro-scope or on high-volume production equipment. Cutting of assorted materials with variable wave-length (1064nm, 532nm, 355nm, and/or 266nm) con- figurations. Accurate cutting control with the standard motorized X-Y aperture. Simple operation via intuitive microprocessor-based, remote-control panel, or through an RS232 interface. Versatile software that allows precise control of ma-chining. Ease of installation and operation > U.S. Patent #. 5,611,946, 5,811,751, 5,963,364, 5,703,713 Japan Patent #. 3026362 size="-1">

Energy (before microscope) > IR/Green Beam Blended (IR/GR) > 3 0.5mJ 0.5mJ > TriLite Beam Blended (IR/GR) > 3 0.5mJ 0.5mJ 0.4mJ > IR Only 2.7mJ Green Only 2.7mJ > Minimum (w/ 100X objective) 2 Եm x 2 m 1 յm x 1 m 1 յm x 1 m 2 յm x 2 m > 7 Maximum (w/ 50 X objective) 50 յm x 50 m 50 յm x 50 m 50 յm x 50 m 50 յm x 50 m > Robust software to support automated cuts. > 1. The micromachining kit is only available with the standard energy range [Class 3B]. The close-loop energy feature is not available for the micromachining kit. 2. Close-loop energy control is designed to compensate for the degradation...