TMA 402 F3 Hyperion Polymer Edition
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TMA 402 F3 Hyperion® Polymer Edition Thermomechanical Analysis – TMA Tailor-Made for Low-Temperature Applications Analyzing & Testing

Tailored to Polymer Applications nt, elopme nd dev lity control earch a a For res input and qu ion t simula Coefficient of linear thermal expansion Phase transition temperatures Glass transition temperatures Dilatometric softening point Volumetric expansion Density changes Delamination Isostrain Creep Relaxation Stress/strain curve Thermomechanical analysis (TMA) is a technique for determining the dimensional changes in solids, liquids or pasty materials as a function of temperature and/or time under a defined mechanical force (DIN 51005, ASTM E831, ASTM D696, ASTM D3386, ISO 11359 – Parts...

CTE measurement on an epoxy resin with a sample length of 6 mm in expansion mode (fused silica sample holder); 1st and 2nd heating runs at a rate of 2 K/min The linear thermal expansion is an important variable for assessing the dimensional change of a material in response to a change in temperature. It shows how much a material will shrink or expand during processing, whether dissimilar materials can be joined, where the phase change occurs and where the CTE changes. This plot shows the thermal expansion (dL/L0 in %) of an epoxy resin between -70°C and 270°C. In the first heating (blue...

TMA 402 F3 Hyperion® Polymer Edition Gaining Valuable Information about Detect Even the Slightest Dimensional Changes The LVDT constitutes the centerpiece of the NETZSCH TMA 402 F3 Hyperion® Polymer Edition. The technology behind it is tried-and-true: Even the slightest of length changes, into the nanometer range (digital resolution of 0.125 nm), can be measured and detected. No-Hassle Cooling to -70°C The TMA 402 F3 Hyperion® Polymer Edition is specifically designed for polymer applications. It comes with a compact, highly reactive furnace capable of covering a temperature range from -70°C...

Product Performance and Processing Behavior Determination of Visco-Elastic Properties like Relaxation, Creep and Stress/Strain The TMA 402 F3 Hyperion® Polymer Edition now offers not only the ability to keep the force constant and to measure the length change, but also to change the dL displacement and measure the corresponding force. This can, for example, be used in a stress relaxation test where a sample is stretched by a specific amount at a defined temperature. During the test, the deformation is kept constant and the progression of the force is recorded. This force continuously...

Accessories for All Application Needs Easy-to-Change Sample Holders for Various Sample Geometries and Measuring Modes The expansion/compression mode is used for samples with different geometries, such as cylindrical or rectangular. Fused silica sample holders The penetration mode determines the softening point of a sample. For this test, sample holders with flat or hemsipherical tips are available. 3-point bending sample holder with a bending length of 5 mm is available. The tension mode is used to measure expansion and shrinkage, creep and relaxation behavior on thin films or fibers....

Defining Ideal Production and Application Conditions for Polymer Materials m. CTE*(-40 ... -20°C) 58.83E-06 1/K m. CTE*(-40 ... -20°C) 54.92E-06 1/K m. CTE*(-40 ... -20°C) 57.14E-06 1/K Relaxation – An Important Material Property for Polymer Films Plastic packaging needs to be flexible, lightweight, strong, sometimes impermeable and, if necessary, easy to sterilize. Both the material used and the process conditions determine the resulting property portfolio. It is important to have knowledge abou ta film material’s relaxation properties; this allows for predictions regarding its fatigue and...

Anisotropic Behavior in Composite Systems 0° in fiber direction 90° to fiber direction Composite material, measured in two directions; sample length 25 mm, heating rate 5 K/min from -70°C to 140°C, N2 atmosphere, sample holder made of fused silica for expansion mode. curve depicts the measurement 6.0 in the fiber direction; the CTE is dominated by the low thermal 5.0 expansion of glass. The sample 4.0 that is 90° to the fiber direction is dominated by the polypropylene matrix and shows a much higher CTE. Therefore, Peak: 46.1 min it is only possible to observe the Tg of PP measured in this...

Specifying the Right Material for Functional Electronics 6.0 Peak: 46.1 min Determination of time to delamination on an FR4 composite circuit board. Sample size 6.35 mm² as defined by IPC, dried for 2 hours pre-measurement at 105°C, heating rate 10 K/min, N2 atmosphere, sample holder made of fused silica; isothermal segment at 260 and 300°C, respectively. Industry standards require the 0.8 measurement of thermal event, the rate of expansion for the 0.6 expansion, glass transition and epoxy matrix increases which can 0.4 softening point under IPC lead to delamination between the 0.2...

Test on Heat-Shrink Tubing Force /N expansion force Measurement on a heat-shrink tubing under constant force (green curves) and under constant displacement (blue curves). Heating from RT to 120°C, atmosphere N2, sample length 25 mm (blue) and 10 mm (green). Heat-shrink tubing, also known as shrink sleeve, is used to repair and insulate wires and cables. After sliding the tubing onto the cable, a heat source is used to make it shrink and create a tight seal. Heat-shrink tubing, by its very nature, is stretchy and changes its shape. A TMA can help to gather information about the temperature...

Thermal Expansion of Insulation Material Polymer foams are used where light weight is required along with an excellent strength-to-weight ratio, superior thermal and acoustical insulation properties, and good energy absorption behavior. Expanded foams such as EPS and EPP are gaining in importance not only in the building, but also in the automotive industry. Therefore, thermal expansion is an important quality criterion when choosing insulation material, since expansion behavior differs significantly among materials with different densities. The foam with the lowest density shows the...