IP-Resist
2Pages

DATA SHEET IP-PHOTORESISTS Nanoscribe’s family of negative-tone IP-photoresists is specifically designed for the demands of true 3D laser lithography by two-photon polymerization (2PP). IP-photoresists provide extraordinary resolution and high mechanical stability for structures in the micro and submicron range. IP-L and IP-L 780 are the liquid photoresist formulations showing the highest resolution achieved so far in combination with Nanoscribe’s laser lithography systems Photonic Professional (see Figure 1). IP-G and IP-G 780 are the corresponding gel formulations of the acrylic photoresist. The high viscosity makes this resist ideal for complex writing tasks with arbitrary writing sequences and minimum feature sizes on the micro- and sub-micrometer scale (see Figure 2). IP-Dip is the specially designed photoresist for Nanoscribe’s novel Dipin Laser Lithography (DiLL) technology. IP-Dip serves as immersion and photosensitive material at the same time by dipping the microscope objective into this liquid photoresist. Due to its refractive index matched to the focusing optics IP-Dip guarantees ideal focusing and hence highest resolution for DiLL (see Figure 3). FEATURES Feature sizes down to 150 nm Low proximity effect Low stress Little shrinkage Good adhesion on glass substrates Features Refractive index at 780 nm unexposed Prebake Cast process Easy handling: drop-casting of the photoresist Exposure Postbake Developer Fig.1: Woodpile structures consisting of parallel rods stacked upon another. The center-to-center rod distance is varied from 1.5 µm to 0.4 µm in steps of 100 nm. Resist: IP-L. Yes Drop casting or spin coating 780 nm for 2PP No Drop casting Fig.2: Eiffel tower, written with Photonic Professional (scale 1:3,000,000). Resist: IP-G.

RESOLUTION Down to 600 nm laterally in 3D 2½ D structuring with enormous design freedom 2D structuring with feature sizes down to 100 nm and resolution down to 300 nm DiLL: Aberration constant writing in liquid resists for ultra-high and precise microstructures even on opaque substrates APPLICATIONS Photonic crystals Photonic wire bonds Micro-optics Micro-/nano-fluidics Biomimetics Ultralight materials Mechanical metamaterials Scaffolds and tissue engineering Fig.3: 280 µm tall woodpile structure written by means of the Dip-in laser lithography technology in IP-Dip photoresist. Micro rapid...