PV Series

PV Series

PV Series

Product catalog summary
Overview: The document describes the PV-1000, a measurement module designed for in-process monitoring of solar/photovoltaic wafers. It highlights the system's capabilities in measuring wafer thickness, total thickness variation (TTV), and bow using advanced capacitance technology.
Specifications: The PV-1000 can handle up to three thickness channels per rack and is scalable for increased line scans. It features fast Ethernet communication for production rates up to five wafers per second and digital I/O for interfacing with existing wafer handling equipment. The system supports both mono and poly-crystalline silicon wafers with various surface types.
Advanced Features: The PV-1000 utilizes MTII's exclusive push/pull capacitance probe technology, which allows for accurate measurements even on poorly grounded or highly resistive targets. This technology also cancels common mode electrical noise, enhancing measurement accuracy.
Integration and Control: The system includes a Windows® based control program for local or remote data monitoring and a DLL package for integration with existing control PCs. Multiple modules can be monitored from a single location using standard TCP/IP protocols.
Applications: The PV-1000 is suitable for process development and production environments, including lap/etch and polishing, final inspection, and slicing processes. It provides detailed measurements such as minimum, maximum, average thickness, and TTV.
Optional Accessories: The document lists optional accessories like low noise extension cables and probe calibrators, which enhance the system's functionality and ease of use.
Ordering Information: The document provides a guide for selecting models and probes, emphasizing the need for two probes per channel and offering custom probe options.
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Catalog excerpts

PV Series-1

A worldwide leader in precision measurement solutions High Speed Multi-Channel, TTV and Bow Measurement Module for In-process Monitoring of Solar/Photovoltaic Wafers MULTIPLE MODULAR TYPE AMPLIFIERS CAN BE CHAINED TOGETHER FOR UNLIMITED LINE SCANS ON THE WAFERR

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PV Series-2

Advanced Features Up to three thickness channels per rack Minimum, maximum, average and total thickness variation measurements Bow measurement (3 probe pairs required) Integrated data aquisition and control electronics Fast Ethernet communications ports for production rates up to 5 wafers per second Scalable for increased number of thickness line scans Digital I/O for interface with existing wafer handling equipment Windows® based control program for local or remote data monitoring Windows® based DLL package for integration with existing control PC's Standard and custom probe sizes available...

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PV Series-3

PV-1000 Wafer Metrology Systems The PV-1000 solar wafer measurement series are ideal for both process development and production environments. Using MTII’s exclusive Push/PullTM capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer. Integrated data acquisition and control electronics analyze and transmit...

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PV Series-4

11.58 mm (0.456 inch) 20 mm (0.787 inch) 100 mm (3.937 inch) 11.58 mm (0.456 inch) 16 mm (0.63 inch) 100 mm (3.937 inch) Spot Size Spot Size Range Extension Range Extension 9.45 mm (0.372 inch) 14.8 mm (0.583 inch) 34.04 mm (1.34 inch) Spot Size 7.11 mm (0.28 inch) 16 mm (0.63 inch) 50 mm (1.969 inch) Range Extension Range Extension Probe Connector Types: ILA Integrated Lead Axial ILR Integrated Lead Radial

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PV Series-5

Specifications Wafer Types Mono or Poly-Crystalline Silicon Surface Types As-Cut, Lapped, Etched, SiN Layer Data Output Data Triggering Rack Dimensions Power Requirements AC (DC Version also available, call MTII for information) Thickness Measurement Probe Range Measurement Accuracy Repeatability Distance between sensors 1778 µm / 70 mils ±0.25 µm / ±0.010 mils 0.05 µm / 0.002 mils 3.4 mm / 0.134 in 2540 µm / 100 mils ±0.75 µm / ±0.030 mils 0.10 µm / 0.004 mils 5.0 mm / 0.197 in Custom probe sizes and measurement ranges available Optional Accessories Product # Product Description 90 Ω Low Noise...

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PV Series-6

Tips for Quick Ordering Process Modular Rack Systems For measuring thickness of solar wafers or semiconductor wafers in automated track systems. Select Model All models below includes amplifier card rack with interface electronics. Proforma PV-1000 Models 2 amplifier cards, software and communication interface for one (1) thickness channel 4 amplifier cards, software and communication interface for one (2) thickness channels 6 amplifier cards, software and communication interface for one (3) thickness channels Select Push/Pull Probes Push/Pull Probes Custom Probes are also available Refer to...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.