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MTI Instruments
PROFORMA 300iSA

PROFORMA 300iSA

Product catalog summary

Overview:
The Proforma 300iSA is a semi-automated wafer measurement system designed for semiconducting and semi-insulating materials. It features a unique 'push-pull' probe technology that enhances measurement accuracy by using two capacitance sensors with a 180-degree phase shift.

Key Features:

Non-contact full wafer scanning.
3-D mapping of thickness and shape.
Measures semiconducting and semi-insulating wafers.
Standard Windows-based user interface.
Powerful software and graphics package.
Customized data reporting and multi-format data export.
Upgradeable to a fully automated system.
Measurement range up to 1000 µm.
Remote data analysis and recipe creation.

Measurement Capabilities:

Thickness and Total Thickness Variation (TTV) with accuracy up to ±0.25 μm and repeatability of 0.050 µm.
Bow and Warp measurements with ranges up to ±1500 μm and accuracy up to ±5.0 μm.
Flatness measurements with accuracy up to ±0.05 μm.

Technical Specifications:

Compatible with wafer sizes: 3" (75 mm), 6" (150 mm), 8" (200 mm), and 12" (300 mm).
Capable of measuring as-cut, lapped, etched, polished, or patterned wafers.

Additional Information:
The system includes a controller and offers options for silicon and gallium arsenide calibration standards. It supports ASTM/SEMI compliant scan patterns and allows for 'what-if' engineering analysis without rescanning the wafer.

Contact Information:
MTI Instruments, Inc., Albany, NY. Phone: +1-518-218-2550, Email: [email protected], Website: www.mtiinstruments.com

Catalog excerpts

A worldwide leader in precision measurement solutions S E M I - A U T O M A T E D W A F E R INSPECTION AND METROLOGY SYSTEM Wafer Measurement Systems for Semiconducting and Semi-insulating Wafers

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THICKNES . ^Rp GLOBAL 2 ¥%OW ^^LATNESS The Proforma 300iSA is a desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. The Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional wafer images. The Proforma 300iSA Controller contains all the electronics and control hardware necessary to control the Measurement Stage. It is also the interface to the external computer. Unique Push/Pull Technology:...

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Customized data reporting, multi-format data export and full network capability allows easy access to your process information from anywhere on your network. The quick and easy to use Windows® - based control system performs complex data analysis and provides output in tabular and 3-D graphical formats which can be exported to spreadsheet and word processing programs. The systems come preset for SEMI standard wafer diameters, with the ability to add custom wafer parameters if required. Each measurement and system parameter is selected from the user-friendly software interface. Parameters can...

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Tw: Gtotal - (GAP© + GAP©) Total Thickness Variation (TTV): Tw/Max -Tw/Min MTI Instruments, Inc. 325 Washington Avenue Extension Albany, NY 12205-5505 PH: +1-518-218-2550 OR USA TOLL FREE: 1-800-342-2203 FAX: +1-518-218-2506 EMAIL: [email protected] www.mtiinstruments.com mti instruments A subsidiary of Mechanical Technology, Inc.(MKTY)

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