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Processor and IC Sockets

Processor and IC Sockets
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1.27mm (.050") Pitch Micro PGA Socket Features and Benefits • Accepts Mobile Pentium® 4 and Mobile Celeron® Processor-M series • Ball Grid Array (BGA) solder balls are self-centering and avoid the problem of bent tails • LCP housing and cover with profile height of 3.30mm (.130") • Dual-beam chamfered contact design provides low insertion force and good electrical performance • Stainless steel cam retainer protects plastic cover from wear 47387 Key Version B Ball Grid Array (BGA) Solder Mount Reference Information Product Specification: PS-51248-020 Packaging: Tray or tape on reel Designed...

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Features and Benefits • Accepts Mobile Pentium® 4 and Mobile Celeron® Processor-M series • Ball Grid Array (BGA) solder balls are self-centering and avoid the problem of bent tails • LCP housing and cover with profile height of 3.30mm (.130") • Dual-beam chamfered contact design provides low insertion force and good electrical performance • Stainless steel cam retainer protects plastic cover from wear 51248 Ball Grid Array (BGA) Solder Mount 479 Circuits Reference Information Product Specification: PS-51248-005 or PS-51248-020 Packaging: Tape on reel Designed In: Millimeters Pick-and...

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