Catalog excerpts
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Open the catalog to page 10.60mm (.0236") Pitch DDR2 miniDIMM Socket 78001/87782/87783/87918 SMT Features and Benefits • Small pitch permits maximum utilization of space available on the PCB • Small form factor allows miniDIMM to fit into slim enclosures • Surface Mount Technology for easy processing and ability to utilize both sides of PCB • Solder pads at both ends and center of housing provide additional mechanical strength after soldering • Robust dual latches provide excellent module retention and easy ejection of module • Accepts JEDEC MO-244 and MO-258 insures 100% industry compatibility • Polarization keys...
Open the catalog to page 2Features and Benefits • Accepts JEDEC MO-256 module for 100% industry compatibility • Dual ejector latches for easy module removal with features to minimize micro motion • Beveled metal pin provides PCB retention during and after soldering • Enables hot plug and hot swap • Simple through-hole design supports low-cost board assembly process Electrical Voltage: 30V Current: 0.5A Contact Resistance: 20 milliohms max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms min. Mechanical Insertion Force to PCB: 66.64N Mating Force: 98.00N Unmating Force: 2.94N Durability:...
Open the catalog to page 31.00mm (.039") Pitch DDR2 DIMM Socket Features and Benefits • High-temperature thermoplastic housing withstands leadfree solder processing • Complies with all JEDEC standards, ensures 100% industry compatibility • Dual ejector latches for easy module insertion and removal with minimal micro-motion • Added contact wipe for improved contact reliability between socket and module card • Forklocks or plastic pegs provide proper socket to PCB alignment, and secure PCB retention during and after soldering • SMT termination (87966 only) allows for space saving and added freedom in the design of the...
Open the catalog to page 4Features and Benefits • Accepts standard JEDEC MO-206 modules • Dual ejector latches align modules for insertion and provide an audible click when it is in the closed position • Forklocks provide PCB retention during and after soldering • Baseplate ensures PC tail true position • Tight stacking distances of 22.86mm (.900") for typical SOJ package and 13.34mm (.525") for TSOP package • Several options for keying and solder tail length 87623/87639 Low Profile Single Key, with Forklocks and Plastic Peg Reference Information Product Specification: PS-87623-002 Packaging: Tray UL File No.:...
Open the catalog to page 51.27mm (.050") Pitch DIMM 8-Byte Socket 87587 168 Circuit, Low Profile (25°) Multi-Key, with Forklocks and Plastic Peg Features and Benefits • Accepts Standards JEDEC MO-161 modules • Dual ejector latches align modules for insertion and provide an audible click when in the closed position • Forklocks provide PCB retention during and after soldering • Base-plate ensures PC tail true position • Tight stacking distances: 22.86mm (.900") for typical SOJ packaging, 13.34mm (.525") for TSOP packaging • Several options for keying and solder-tail length Electrical Voltage: 100V Current: 1.0A...
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