MDX3D R15 IC Packaging
4Pages

Encapsulation Innovation

Mold Encapsulation Innovation Moldex3D offers a complete suite of 1C Packaging simulation solutions for various steps in production process to assist industry professionals in validation and optimization. Considering chip design, material properties and process conditions, Moldex3D’s promising solutions surely bring quality, reliability and process efficiency. Validate design with alliance co-simulation solution ■ ■ andABAQUS ■ ture variation ■ Support Cadence 3DI models and properties

1C Packaging Solutions to Manufacturing Processes Moldex3D provides a variety of solutions for 1C packaging, such as transfer molding, compression molding simulations and the Underfill process from 2.5D to 3D 1C stacking. The Underfill process includes Capillary Underfill (CUF), No-flow Underfill (NUF), Molded Underfill (MUF), Non-conductive Paste (NCP), Embedded Wafer Level Package (EMWLP), etc., for the growing application of 3D 1C stacking. Underfill molding simulation ■ ■ ■ Post Mold Cure warpage simulation ■ ■ ■ Compression molding simulation ■ ■ ■ Support particle tracking for result...

# Essential features contained IO Optional features Molding Process Transfer Molding Mesh Technology Simulation Capabilities Solver Capabilities Material Test Mesh Designer Cadence Interface O Flow, Cure, Warp Thermal Analysis Stress Wire Sweep Paddle Shift FEA Interface Project Parallel Processing Viscosity (Rheometer) Curing Kinetics (DSC) Solution Add-on Material Test Specific Volume (PVTC) Visco-elastics Modulus (DMA) Contact Angle Molding Process Compression Molding -Compression Molding -No Flow Underfill (NUF) -Embedded Wafer Level Package (EWLP) Underfill -Capillary Underfill...