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eDesign

eDesign

eDesign

Product catalog summary
System Requirements:
The software supports Windows platforms including Windows 8.1, 8, 7, Server 2012, and 2008. Minimum hardware requirements include an Intel® Core i7 processor, 8 GB RAM, and 100 GB of free space. Recommended specifications are an Intel® Xeon® E5 processor, 32 GB RAM, and 500 GB of free space.
Product Features:
Moldex3D eDesign offers a range of features for injection molding simulation, including modules for standard injection molding, multiple component molding, and parallel processing. It supports CAD interoperability with tools like Creo, NX, and SOLIDWORKS® and includes advanced features for special molding processes such as advanced hot runner systems and powder injection molding.
eDesign Capabilities:
The software provides comprehensive 3D simulations to validate and optimize plastic part and mold designs. It features an automatic 3D meshing engine and intelligent modeling wizards to facilitate model creation and verification. The software supports multi-core and multi-CPU parallel processing to enhance simulation speed and accuracy.
Benefits:
Moldex3D eDesign helps reduce design cycles, costs, and time to market while maximizing productivity and return on investment. It addresses common manufacturing challenges by predicting and solving up to 85% of issues upfront, thus driving product innovation and competitiveness.
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Catalog excerpts

eDesign-1

Product Features eDesign Basic Module Capabilities Standard Injection Molding Multiple Component Molding (MCM)* YES Solution Add-on CAD Interoperability eDesignSYNC (for Creo, NX, SOLIDWORKS®) Optional Optional Cooling Channel Designer (CCD) Fiber Reinforced Plastics Fiber* Micromechanics Interface Expert* Special Molding Process Advanced Hot Runner 3D Coolant CFD Powder Injection Molding (PIM) Optional Optional A module marked with an asterisk (*) is also available for thermoset analysis. MuCell® is a registered trademark of Trexel, Inc. System Requirements: Windows Intel® Core i7 processor, 8 GB RAM, and at least 100 GB of free space Intel® Xeon® E5 processor, 32 GB RAM, and at least 500 GB of free space CoreTech System Co., Ltd. Headquarters 8F-2, No.32, Taiyuan St. Chupei City Hsinchu County 302, Taiwan Tel: +886-3-560-0199 E-MAIL [email protected] Moldex3D Northern America Inc. 27725 Stansbury Blvd., Suite 190, Farmington Hills, MI 48334, USA Tel: +1-248-946-4570 E-MAIL [email protected] For more information, please visit www.moldex3d.com © 2014 CoreTech System(Moldex3D). All rights reserved. DM-eDesign-R13-EN-14-V1 eDesign Ensure your design Validate and optimize part/mold designs with true 3D simulations Minimize design cycle, cost and time to market Maximize productivity and return on investment

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eDesign-2

Pioneering Automatic 3D Technology Simulation Drives Product Innovation Moldex3D eDesign is the globally leading manufacturing simulation and visualization software that enables designers and mold makers to validate and optimize their designs of plastic parts and molds. Companies nowadays are facing with similar manufacturing challenges: productivity performance and defective rate, cost reduction, time to market, market demands for various products in fit, form, and function, etc. Moldex3D eDesign helps these companies tackle significant issues and decide solutions more efficiently; 85% of common...

 Open the catalog to page 2
eDesign-3

Pioneering Automatic 3D Technology Simulation Drives Product Innovation Moldex3D eDesign is the globally leading manufacturing simulation and visualization software that enables designers and mold makers to validate and optimize their designs of plastic parts and molds. Companies nowadays are facing with similar manufacturing challenges: productivity performance and defective rate, cost reduction, time to market, market demands for various products in fit, form, and function, etc. Moldex3D eDesign helps these companies tackle significant issues and decide solutions more efficiently; 85% of common...

 Open the catalog to page 3
eDesign-4

Product Features eDesign Basic Module Capabilities Standard Injection Molding Multiple Component Molding (MCM)* YES Solution Add-on CAD Interoperability eDesignSYNC (for Creo, NX, SOLIDWORKS®) Optional Optional Cooling Channel Designer (CCD) Fiber Reinforced Plastics Fiber* Micromechanics Interface Expert* Special Molding Process Advanced Hot Runner 3D Coolant CFD Powder Injection Molding (PIM) Optional Optional A module marked with an asterisk (*) is also available for thermoset analysis. MuCell® is a registered trademark of Trexel, Inc. System Requirements: Windows Intel® Core i7 processor,...

 Open the catalog to page 4
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.