HDI (High Density Interconnect) Flexible Circuits Brochure

Product catalog summary

Overview: Minco specializes in High Density Interconnect (HDI) flexible circuits, primarily serving medical, aerospace, and defense sectors. With over 35 years of experience, Minco ensures consistent product quality through ISO 9001:2000 and AS9100B certifications.

Manufacturing Capabilities: Minco's state-of-the-art facility supports HDI circuit production with advanced equipment for microvias and fine line widths. Key processes include laser drilling, laser direct imaging, copper plating, automated optical inspection, and electrical verification.

Benefits of HDI Circuits: HDI flex circuits offer reduced size and cost, advanced component packaging, improved electrical and thermal performance, and enhanced design flexibility. These circuits allow for higher circuit density, improved signal integrity, and cost-effective assembly processes.

Technical Specifications: - Minimum microvia size: 75 micron (50 micron finished)
- Minimum line and spacing: 50 micron
- Microvia blind plating aspect ratio: 1:1
- Minimum core dielectric thickness: 25 micron
- Minimum copper thickness: 9 micron
- Blind & buried via construction using sequential build technology

Contact Information: Minco's headquarters are located in Minneapolis, MN, with additional offices in France and Singapore. Contact details include phone numbers and email for sales inquiries.

Catalog excerpts

HDI (High Density Interconnect) Flexible Circuits Brochure-1

INDUSTRY GUIDE Flex Circuits Thermofoil™Heaters Sensors Instruments HDI GUIDE High Density Interconnect (HDI) Flexible Circuits

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HDI (High Density Interconnect) Flexible Circuits Brochure-2

The many reasons to choose Minco HDI flexible circuits Minco is a supplier with over 35 years of flexible circuit experience focusing on components for critical applications. With over 75 percent of our flexible circuits going into medical, aerospace and defense applications, Minco has the systems and processes in place to assure you of consistent product every time you order. With Minco's state of the art facility and equipment; ISO 9001:2000 and AS9100B certifications, Minco can provide you with High Density Interconnect (HDI) flexible circuits with unmatched features and performance. Additionally,...

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HDI (High Density Interconnect) Flexible Circuits Brochure-3

· 9 micron copper · 225 micron diameter pad · 75 micron laser drilled microvia · 50 micron finished via · 100 micron laser drilled microvias · 75 micron finished vias · Blind & buried via construction Minco HDI Design Options Specifications: Minimum microvia size: 75 micron, 50 micron finished Minimum microvia pad size: via diameter +150 microns Minimum line and spacing: 50 micron Microvia blind plating aspect ratio (depth to diameter): 1:1 Minimum core dielectric thickness: 25 micron Minimum copper thickness: 9 micron Blind & buried via construction: sequential build technology 2,177 Microvias...

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HDI (High Density Interconnect) Flexible Circuits Brochure-4

Worldwide Headquarters 7300 Commerce Lane Minneapolis, MN 55432 USA Tel: 1.763.571.3121 Fax: 1.763.571.0927 [email protected] www.minco.com HDI01122209R0 © Minco 2010 European Headquarters Usine et Service Commercial, Z.I. 09310 Aston, France Tel: (33) 5 61 03 24 01 Fax: (33) 5 61 03 24 09 Asia Pacific Headquarters 20 Science Park Road #02-31 Teletech Park Singapore Science Park II Singapore 117674 Tel: (65) 6511 3388 Fax: (65) 6511 3399 Flex Circuits Thermofoil™ Heaters Sensors Instruments

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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