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ATmega4809

Product catalog summary

Introduction
The ATmega4809 microcontrollers are part of the megaAVR® 0-series, featuring an AVR® processor with a hardware multiplier, operating up to 20 MHz. They offer a flexible, low-power architecture with advanced peripherals and accurate analog features. The 40-pin version uses the die of the 48-pin ATmega4809 but with fewer connected pads, requiring certain pins to be disabled or have pull-ups enabled.

Features

CPU: Single-cycle I/O access, two-level interrupt controller, two-cycle hardware multiplier.
Memory: Up to 48 KB Flash, 256B EEPROM, up to 6 KB SRAM with specific write/erase endurance and data retention capabilities.
System: Includes Power-on Reset, Brown-out Detector, multiple clock options, and three sleep modes.
Peripherals: Features timers, USART, SPI, TWI, Event System, Configurable Custom Logic, ADC, and more.
I/O and Packages: 34 programmable I/O lines in a 40-pin PDIP package.
Temperature and Speed Grades: Supports industrial and extended temperature ranges with various speed grades depending on voltage.

Pinout and I/O Multiplexing
Detailed pinout information for the 40-pin PDIP package, including multiplexed signals and considerations for using alternate pin positions.

Electrical Characteristics

Disclaimer: Typical values are measured at 25°C and 3V, with minimum and maximum values valid across operating conditions.
Absolute Maximum Ratings: Lists stress ratings for power supply voltage, current, and pin voltage, noting that exceeding these may cause permanent damage.

Specifications and Operating Conditions

Injection Current: I/O pin injection current should be between -15 mA and 15 mA, except for the RESET pin.
Storage Temperature: The device can be stored between -65°C and 150°C.
Operating Supply Voltage (VDD): Ranges from 1.8V to 5.5V.
Operating Temperature Range (TA): -40°C to 125°C.

Clock and Frequency
The maximum CPU clock frequency is dependent on VDD, with specific frequencies outlined for different voltage ranges:

5 MHz for VDD between 1.8V and 2.7V.
10 MHz for VDD between 2.7V and 4.5V.
20 MHz for VDD between 4.5V and 5.5V.

Power Considerations
Power dissipation and thermal management are crucial for device performance. The average die junction temperature (TJ) is calculated using the formula: TJ = TA + PD * RθJA, where PD is the total power dissipation. Effective thermal management can reduce RθCA, thus minimizing RθJA.

Power Consumption

Active Mode: At 20 MHz and VDD=5V, typical consumption is 8.5 mA.
Idle Mode: At 20 MHz and VDD=5V, typical consumption is 2.8 mA.
Standby and Power-Down Modes: Consumption is significantly lower, with standby at 0.7 µA using RTC at 1.024 kHz.

Peripherals Power Consumption
Additional current consumption for various peripherals is provided, such as:

BOD continuous mode at 19 µA.
ADC at 50 ksps consuming 330 µA.

BOD and POR Characteristics

BOD Detection Levels: Varies with BODLEVEL settings, e.g., BODLEVEL0 is between 1.7V and 2.0V.
POR Threshold Voltage: Ranges from 0.8V to 1.8V depending on conditions.

External Reset and Oscillator Characteristics

RESET Input Voltage: Must be between 0.7×VDD and VDD+0.2V.
20 MHz Internal Oscillator: Factory calibrated frequency with a total error of ±1.5% at 25°C.

I/O Pin Characteristics

Input Low Voltage (VIL): Maximum of 0.3×VDD.
Input High Voltage (VIH): Minimum of 0.7×VDD.
Drive Strength: Varies with VDD, e.g., at 5V, IOL is 15 mA.

USART and SPI Timing
Timing requirements for USART in SPI mode and SPI in both master and slave modes are detailed, with specific timing characteristics for clock frequency, setup, and hold times.

TWI Timing Requirements
The Two-Wire Interface (TWI) timing requirements are outlined with parameters such as clock frequency, input/output voltages, and rise/fall times. The SCL clock frequency can reach up to 1 MHz under specific conditions.

Voltage Reference Characteristics
Internal voltage references are specified for various voltage levels (0.55V, 1.1V, 1.5V, 2.5V, 4.3V) with operating conditions including a power supply range of 1.8V to 5.5V and temperature range from -40°C to 125°C.

ADC Characteristics
The ADC section details internal and external reference characteristics, including resolution, linearity, and accuracy. The ADC supports a sample rate up to 115 ksps with a resolution of 10 bits.

Analog Comparator Characteristics
The document specifies input voltage ranges, offset voltages, and propagation delays for the analog comparator, both in low-power and normal modes.

UPDI Timing
The Unified Program and Debug Interface (UPDI) timing parameters are provided for enabling sequences, with specific durations for handshake and debugger signals.

Programming Times
Typical programming times for Flash and EEPROM are listed, including page write and erase times.

Power Consumption
Detailed graphs illustrate active, idle, power-down, and standby mode supply currents across various frequencies, voltages, and temperatures. The microcontroller's power efficiency is highlighted under different operational conditions.

GPIO Characteristics
Input characteristics for GPIO pins are provided, including hysteresis and threshold voltages relative to VDD.

Input Threshold Voltage
The threshold voltage for I/O pins varies with VDD and temperature, indicating the voltage levels at which the pins recognize a logical low (VIL).

GPIO Output Characteristics
Graphs illustrate the relationship between I/O pin output voltage and sink/source current at different VDD levels (1.8V, 3.0V, 5.0V) and temperatures, showing how output voltage changes with current load.

Pull-Up Characteristics
The pull-up resistor current varies with input voltage and temperature, affecting the current drawn by the pull-up resistors at different VDD levels.

VREF Characteristics
Internal voltage references (0.55V, 1.1V, 2.5V, 4.3V) show error percentages across temperatures, crucial for ADC accuracy.

BOD Characteristics
Brown-Out Detection (BOD) current and threshold levels are detailed, showing how they change with VDD and temperature, important for power management.

ADC Characteristics
Absolute accuracy, DNL, gain, and offset errors are plotted against VDD and Vref, highlighting ADC performance under different conditions.

AC Characteristics
Hysteresis and offset voltage variations with common mode voltage are presented, affecting signal integrity.

Oscillator Characteristics
The internal oscillator's frequency stability is shown against calibration values, temperature, and VDD, impacting timing accuracy.

Ordering Information
Details on available product configurations, including package types, temperature ranges, and ordering codes, are provided for procurement purposes.

Catalog excerpts

Introduction The ATmega4809 microcontrollers of the megaAVR® 0-series are using the AVR® processor with hardware multiplier, running at up to 20 MHz, with a wide range of Flash sizes up to 48 KB, up to 6 KB of SRAM, and 256 bytes of EEPROM in 28-, 32-, 40-, or 48-pin package. The series uses the latest technologies from Microchip with a flexible and low-power architecture including Event System and SleepWalking, accurate analog features and advanced peripherals. The devices described here offer a Flash size of 48 KB in a 40-pin package. Important: The 40-pin version of the ATmega4809 is using the die of the 48-pin ATmega4809 but offers fewer connected pads. For this reason, the pins PB[5:0] and PC[7:6] must be disabled (INPUT_DISABLE) or enable pull-ups (PULLUPEN). Features • AVR® CPU: - Single-cycle I/O access - Two-level interrupt controller - Two-cycle hardware multiplier • Memories: - Up to 48 KB In-system self-programmable Flash memory - 256B EEPROM - Up to 6 KB SRAM - Write/Erase endurance: • Flash 10,000 cycles • EEPROM 100,000 cycles - Data retention: 40 Years at 55°C • System: - Power-on Reset (POR) circuit - Brown-out Detector (BOD) - Clock options: • 16/20 MHz low-power internal oscillator • 32.768 kHz Ultra Low-Power (ULP) internal oscillator • 32.768 kHz external crystal oscillator • External clock input - Single pin Unified Program Debug Interface (UPDI) - Three Sleep modes: • Idle with all peripherals running for immediate wake-up • Standby - Configurable operation of selected peripherals Preliminary Datasheet

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– SleepWalking peripherals • Power-Down with limited wake-up functionality Peripherals: – One 16-bit Timer/Counter type A (TCA) with a dedicated period register and three compare channels – Four 16-bit Timer/Counter type B with input capture (TCB) – One 16-bit Real-Time Counter (RTC) running from an external crystal or an internal RC oscillator – Four USART with fractional baud rate generator, auto-baud, and start-of-frame detection – Master/slave Serial Peripheral Interface (SPI) – Dual mode Master/Slave TWI with dual address match • Standard mode (Sm, 100 kHz) • Fast mode (Fm, 400 kHz) • Fast...

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Preliminary Datasheet

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Block Diagram AINPn AINNn OUT AINn VREFA LUTn-INn LUTn-OUT EVSYS CCL TCAn TCBn SDA (master) SCL (master) SDA (slave) SCL (slave) System Management RSTCTRL Detectors/ References RESET RST CLKCTRL SLPCTRL Clock Generation CLKOUT Preliminary Datasheet

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ATmega4809 – 40-Pin I/O Multiplexing and Considerations Note: 1. Pin names are of type Pxn, with x being the PORT instance (A,B,C, ...) and n the pin number. Notation for signals is PORTx_PINn. All pins can be used as event input. 2. All pins can be used for external interrupt, where pins Px2 and Px6 of each port have full asynchronous detection. 3. Alternate pin positions. For selecting the alternate positions, refer to the PORTMUX documentation. 4. The 40-pin version of the ATmega4809 is using the die of the 48-pin ATmega4809 but offers fewer connected pads. For this reason, the pins PB[5:0]...

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Electrical Characteristics 4.1 Disclaimer All typical values are measured at T = 25°C and VDD = 3V unless otherwise specified. All minimum and maximum values are valid across operating temperature and voltage unless otherwise specified. Typical values given should be considered for design guidance only, and actual part variation around these values is expected. 4.2 Absolute Maximum Ratings Stresses beyond those listed in this section may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated...

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1. Operation is ensured down to 1.8V or VBOD with BODLEVEL0, whichever is lower. Table 4-3. Operating Voltage and Frequency Note: 1. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL0. 2. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL2. 3. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL7. 4. These specifications do not apply to automotive range parts (-VAO). The maximum CPU clock frequency depends on VDD. As shown in the figure below, the maximum frequency vs. VDD is linear between 1.8V < VDD < 2.7V and 2.7V < VDD < 4.5V. Figure...

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R0JC is device related and cannot be influenced by the user. However, R0CA is user-dependent and can be minimized by thermal management techniques such as heat sinks, ambient air cooling, and thermal convection. Thus, good thermal management on the part of the user can significantly reduce R0CA so that R0JA approximately equals R0JC. The power dissipation curve is negatively sloped as ambient temperature increase. The maximum power dissipation is, therefore, at minimum ambient temperature while the highest junction temperature occurs at the maximum ambient temperature. Table 4-4. Power Dissipation...

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