Sensors & Applications Semiconductor Industry

Completed wafer Material deposition Coating Slicing Photoresist coating Measurement tasks in the semiconductor industry place high demands on the sensors used. Micro-Epsilon offers a wide range of high-precision displacement sensors that are used for various measurement tasks along the entire process chain in semiconductor manufacturing and processing. Developing/ baking Our sensors deliver exceptional performance in all process steps and are used around the world by leading machine builders and semiconductor producers – for example in environments with high acceleration, strong magnetic fields...

In-house manufacturing with the latest equipment for extra fast response times High delivery capacity and consistent cooperation Jilt Sensors and accessories made of low-outgassing materials

Why Micro-Epsilon? More precision and innovation – Made in Germany Ready for semicon Due to the high demands of sensor production, all sensors and systems by Micro-Epsilon are put through rigorous manufacturing and test processes. This relates to the selection and placement of the electronics, the mechanical manufacturing procedure and special process technology. C onsultation, development & production from a single source H and in hand with our customers: quality and problem-solving expertise in series & OEM In-depth technological and practical knowledge The methods used make it possible to...

Quality control in wafer fabrication  Non-contact measurements from a safe distance  Robust sensors for harsh environments  High accuracy and signal stabil

Monitoring the axial movement of annular saws Annular saws are used for cutting silicon ingots. The saw blade or the holder is monitored using eddy current sensors. Thanks to their high frequency response and insensitivity to dust and contaminations, the sensors provide reliable measurements of the saw blade's axial deviation. This ensures a homogeneous and uniform cut for the silicon wafers. Monitoring the deflection of wire saws Wire saws are used to cut ingots in one step. Since the wire is subject to high wear, the wire bed is monitored at several points using eddy current sensors. They detect...

Monitoring the mask alignment  High-resolution measurement down to the nanometer range  Fast measuring rates for dynamic process monitoring  Ideal for regulating and monitoring mask alignm

Positioning and alignment of lithography masks In the lithography process, high-resolution measurements with long-term stability are required to achieve maximum precision when recording machine movements. Depending on the accuracy requirements, installation space and metrological specifications, various measurement methods from Micro-Epsilon can be used to monitor the ultra-precise mask alignment and fine positioning Confocal chromatic sensors monitor the gap between the mask and the glass. Thanks to the 90° design, the sensors can be integrated in an extremely spacesaving manner. Sensor: confocalDT...

Monitoring the lens system  Non-contact measurements with high dynamism  High resolution down to the nanometer range  Optical and electromagnetic sens

Position measurement of lenses and optical systems Highly dynamic displacement sensors detect the position of lens elements and mirrors without contact so as to achieve the highest possible imaging accuracy. The sensors measure against the metallic mount and also directly onto the lens. As a result, the sensors detect the horizontal and vertical movement of individual mirrors, lenses and lens carriers. Confocal chromatic sensors are used to measure the alignment of the optics. Several sensors measure directly onto the optics in order to detect the tilt with nanometer precision. Sensor: confocalDT...

Positioning during wafer handling Non-contact measurements with high precision High-resolution monitoring of wafer and machine movements Ideal for regulation and alignm

Position determination during wafer handling When handling wafers, exact and repeatable positioning is crucial. When feeding wafers, two optoCONTROL laser micrometers check the diameter and thus determine the horizontal position. Thanks to the high measuring rate and the high measuring accuracy, the micrometers provide reliable data on the position. Sensor: optoCONTROL 2520 Wafer tilt measurement White light interferometers are used to measure the horizontal tilt of wafers when wafers are being fed in. The interferometers provide absolute distance values at subnanometer resolution. The measurement...

Position monitoring in the stage Non-contact measurements with nanometer precision Robust and insensitive to magnetic fields, EMC and acceleration Sensors designed for vacuums and U

Wafer stage positioning Non-contact sensors by Micro-Epsilon are used to monitor the position of the wafer stage. There, they measure the highly dynamic XYZ movements. The inductive eddy current sensors achieve a resolution in the nanometer range. Thanks to their robust design and high dynamism, the stage position is reliably detected even at the highest rates of acceleration. Sensor: capaNCDT / eddyNCDT Positioning the wafer stage using capacitive sensors Capacitive sensors are used for fine positioning in the wafer stage. Thanks to their triaxial design, the sensors are insensitive to electromagnetic...

Mirror tilt and beam stabilization Quick measurement of mirror tilt High angular resolution Bandwidth 1

Mirror tilt monitoring Micro-Epsilon offers highly integrated actuator systems for challenging environmental conditions. One example is the fast steering mirror, which is equipped with optimized non-contact displacement sensors. This micromechatronic actuator system is used in lithography as well as in singulation to monitor the rapid tilting of mirrors as well as beam stabilization. Specification FSM3000 Mirror diameter Overall diameter Angular resolution Mirror with 20 mm diameter Wear and friction-free tilting mechanism Mirror support Flex cable Feedback system (eddy current sensor)