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5D Solder Paste Inspection System √ Automatic solder paste inspection after the printing Measure and control your print quality with real-time feed back √ Detects anomalies in the printing process Tune your printing process before defects occur √ Measures: True volume, height, area, offset and shape Measure all major parameters of the solder paste printing and bridging without compromise, find defects and optimize your process √ High speed inspection with 5D technology, measuring beyond the bounds of apertures Patented advanced sensor technology for 3D and 2D simultaneous inspection, with 2D to 3D comparative analysis to determine slump and release √ 3rd Generation Head design The new inspection head up to 3x speed of previous generation and enhances accuracy and repeatability √ Accurate and precise volume and height measurement (3D) Adjust your solder paste printer for immediate yield improvement √ True area measurement and offset and shape inspection (2D) Improve fast moving yield fluctuations and incidental printing defects. Find solder paste slumping √ Process Control and Production Control Bring the real world in to your analysis and get tighter tolerances for tighter control √ Onboard extensive SPC tool Integrated real time statistics for instant feedback. Simple to use and easy to understand √ Topographical zero referencing Accurate and precise measurement of the solder pad height reference level including warped PCB’s with true colour reference extraction √ Shadow free measurement Minimize blind spots; reliable solder paste volume and height measurement √ Multi colour lighting system Accommodates light and dark PCB’s of any colour. Flex and Ceramic. √ Step by step simple and fast programming Create full inspection programs in minutes

Hardware and Software Features Dual Projection, Full colour, Simulations 3D and 2D Image capture. Complete image capture. Providing the most detailed image of the Solder paste and PCB. Using the Patented 5D sensor technology. With Episcopic Lighting and Telecentric Blue Violet lasers, for extremely stable high resolution capture. 5D Sensor Imaging. See more than conventional 3D SPI. Capture below zero reference defects. True Area, Volume, Height , Offset and bridges. With Parallel full time, 3D and colour 2D capture the MEK S2 that can see defects beyond pure 3D SPI. Below Zero defects....

Hardware and Software Features — Continued Unparalleled Live process feed back Extensive options for live process display. Topographical Height Volume and area maps. Histogram analysis by group. The Ultimate in Process control Prevent Up to 70% of end of line Solder Defects. Utilise in-depth solder deposition analysis. Understand and tune the Solder Paste print process. SPC One Version 3, SPC Field (for AOI) and FIBERSystem Process control and Studies can be easily implemented. SQL data storage either locally or on a remote server, And data export to Excel or CSV formats. Transition charts...

Mek reserves the right to change the design and specifications without notice. © Mek Europe, November 2016 Represented/Distributed by: Mek Americas LLC 4425 E Sahara Ave., STE 41 Las Vegas, NV 89104 USA T +1 702 818 1706 info@marantz-electronics.com www.marantz-electronics.com Mek Europe BV Polluxstraat 2b 5047 RB Tilburg, Netherlands T +31 40 7114111 info@mek-europe.com www.mek-europe.com because inspection matters