PowerSpector
4Pages

Revolutionary Selective 3D imaging technology Selective 3D imaging of components, side cameras integrated in 3D processing. Newest generation 5MP USB 3 Vision Cameras The latest generation of high speed, high quality cameras No capture card requirements. 2X FOV over previous Generation Up to 50% reduction of cycle time. Multi-color 4 angle lighting with Line Source Coaxial Lighting and Meniscus Profiler Reliable solder joint meniscus and pad surface analysis to find solder and paste printing defects Can be used for inspection in all stages of the production process; in-process inspection, final inspection, and first article. Components: SMT & THT (missing, type, polarity, offset, text, colors, etc.) Component Height and Coplanarity Solder Paste and CIP (Components in Paste; pre-reflow) Soldering: Post Reflow, Post Wave, Selective, Manual Integrate AOI efficiently in your existing operations and factory layout Line Sourced DOAL (Direct On Axis Lighting) coaxial lighting system with high resolution Telecentric Optics……………… Inspect solder joints without shadow effects from tall components nearby and accurate inspection model building Low Noise Large CCD High Speed 24 bit Color Camera Find defects easier including printing defects on Gold or Copper plated PCB’s Powerful algorithms to achieve an optimal balance between defect detection and false call levels in shortest time Triple-use of side cameras Use in automatic inspection program and defect classification + repair post-inspection Program in minutes to verify your production line is setup correctly before starting full production In height adjustable optical head Compensate for PCB warp and adapt to tall component and sandwich assemblies because inspection matters

Hardware and Software Features Revolutionary 3D imaging True Stereoscopic imaging using 9 cameras. Full colour 3D allows the ability to actually see the side of components rather than extruded 2D images. Using the addition of a 4th LED white light The Perfect Combination of 3D and 2D Inspection Algorithms Height, tilt and coplanarity measurement. Pin Height measurement Component Presence Absence, Polarity, Value, Angle, Offset, Colour, Extra part detection, Solder ball detection, Solder profile analysis and short detection. The thickness of chip capacitors in combination with colour makes a...

Hardware and Software Features — Continued Double size FOV (Field of view) Up to 2x faster inspection over previous generations of machines. Square FOV combined with circular lighting allows for program rotation without time consuming debugging. Large pixel image capturing sensor 15µm2 pixel size — less noise — smooth and detailed image— great dynamic range High dynamics sensor In Height Adjustable Optical Head In Z-Axis moving Top Camera, Light and Side View cameras — Adaption to any PCB Thickness — PCB Warp Compensation — Inspection of PCB’s with very tall components — Reliable text...

Desktop Series Specifications Mek Europe reserves the right to change the design and specifications without notice. © Mek Europe BV, October 2022 R3 Represented/Distributed by: Mek Americas LLC 5550 Painted Mirage Rd., STE 320 Las Vegas, NV 89149 USA T +1 702 660 6112 info@marantz-electronics.com, www.marantz-electronics.com Mek Europe BV Polluxstraat 2b 5047 RB Tilburg, Netherlands T +31 40 7114111 info@mek-europe.com, www.mek-europe.com because inspection matters