S60
S60
- Frame Size: Maximum 584 x 584 mm with rapid tensioning frame (4 fold). Other frame types may be accepted.
- PCB Size: Maximum 440 x 440 mm.
- Squeegee Drive: Electric drive control with a print speed of 5-150 mm/s. The squeegee travel is freely programmable.
- Squeegee Changeover: Features an automatic reversible dual squeegee with universal holders for metal or rubber blades. The squeegee inclination is adjustable from 0 to 60°, and contact pressure is adjustable from 0 to 200 N.
- Printing Capabilities: Supports single or double-sided boards.
- Table Lowering: Automatic table lowering with a Z-axis range of 10 mm. The lowering speed is adjustable from 0.2 to 4 mm/s, and table contact pressure is adjustable from 0 to 450 N.
- Table Adjustment: X, Y / Theta adjustment of +/- 12 mm / +/- 2.7° with an off-contact (Z-Axis) range of 0-24 mm. Adjustment accuracy is +/- 0.01 mm.
- Supply Requirements: Requires compressed air at 8 bar.
- Dimensions and Weight: 860 x 750 x 450 mm, approximately 90 kg.
Catalog excerpts
Stencil printer S60 • autodrive stencil printer • Technical data • • • • Frame size max. 584 x 584 mm Rapid tensioning frame – 4 fold another types of frames may be accepted • • PCB size max. 440 x 440mm • • • • Squeegee drive electric drive control print speed 5-150mm/s freely programmable squeegee travel • • • • • Squeegee changeover Automatic reversible dual squeegee Universal holders for metal or rubber blade adjustable squeegee inclination 0 - 60 ° adjustable squeegee contact pressure 0 - 200 N • • Printing Single or double-sided boards • • • • Table lowering automatic table lowering / Z=10 mm lowering speed adjustable 0,2 - 4 mm/s adjustable table contact pressure 0 - 450 N • • Table - X, Y / Theta adjustment +/- 12 mm / +/- 2,7° • • Off-Contact (Z-Axis) Range 0 -24 mm • • Table - adjustment accuracy +/- 0,01 mm • • Supply Compressed air 8 bar • • Dimensions and wight 860 x 750 x 450 mm / ca. 90 kg • • • • • Application area low or middle volume production screen- or stencilprinting of glue, solder paste or another substances qualified for fine pitch components minimum pitch of pads 0,3mm Subject to technical alteration
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