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Reflow ovens
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Reflow ovens
Product catalog summary
Reflow Ovens Overview
1. Hot Air / Infrared Reflow Ovens
- RK320: Features a heating area of 320 x 220 mm, supports lead-free soldering, and has a maximum temperature of 290°C.
- RK360: Offers a heating area of 330 x 220 mm, supports lead-free soldering, with a maximum temperature of 300°C.
- RK460: Provides a larger heating area of 400 x 320 mm, supports lead-free soldering, and reaches a maximum temperature of 300°C.
2. Convection Conveyor Reflow Ovens
- R260: Features a process chamber length of 860 mm, accommodates a maximum PCB width of 260 mm, and supports lead-free soldering.
- R360: Has a longer process chamber of 1400 mm, supports a maximum PCB width of 360 mm, and is designed for lead-free soldering.
Additional Information
The document references the second quarter of 2017, possibly indicating a timeline for updates or releases.
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Catalog excerpts
Reflow ovensHot air / Infrared reflow oven RK320 Heating area 320 x 220 mm Lead free soldering max. temp. 290°C Heating area 330 x 220 mm Lead free soldering max. temp. 300°C Heating area 400 x 320 mm Lead free soldering max. temp. 300°C convection conveyor reflow oven R260 lenght of the process chamber - 860mm max. PCB width 260 mm lead free soldering convection conveyor reflow oven R360 lenght of the process chamber - 1400mm max. PCB width 360 mm lead free soldering
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.