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R460 full-convektion reflow oven
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R460 full-convektion reflow oven
Product catalog summary
Reflow Oven R460 Overview
This document provides technical specifications for the Reflow Oven R460, a lead-free compatible reflow oven designed for PCB soldering.
Specifications
- PCB Width: Maximum of 460 mm
- Clearance for Assemblies: Up to 25 mm
- Heating Zones: 7 microprocessor-controlled zones
- Process Chamber Length: 2400 mm
- Heat Distribution: Forced air convection
- Soldering Temperatures: Range from 180 to 300 ºC
- Conveyor: Stainless steel spring wires conveyor belt
- Conveyor Speed: Adjustable from 10 to 120 cm/min
- Heat-up Time: Approximately 30 minutes
- Optional Feature: Stand
- Rated Power: Maximum of 15000 W
- Power Supply: 380 VAC
- Dimensions and Weight: 3400 x 1020 x 1400 mm, approximately 380 kg
Additional Information
The specifications are subject to technical alterations.
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Catalog excerpts
Reflow oven R460 • Reflow oven R460 • technical data: • Lead free • yes • PCB width • max. 460 mm • Clearance for assemblies • Up to 25 mm • Heating zones • 7 heating zones mecroprozessor controlled • Length process chamber • 2400 mm • Heat distribution • Forced air convection • Soldering temeratures • 180 – 300 ºC • Conveyor • Stainless steel spring wires conveyor belt • Conveyor speed • 10 – 120 cm / Min. • Heatup time • ca. 30 min • Option • Stand • Rated power • max. 15000 W • Power • 380 VAC • Dimensions and wight • 3400 x 1020 x 1400 mm / ca.380 kg • Subject to technical alteration
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.