SMT pick & place system P50 • Subject to technical alteration · TECHNICAL DATA · PCB · max. placement area 400 x 500mm · Components range · from 0201 up to 50 x 50mm · Pitch min. 0,4mm · BGA / ìBGA · Components packing · tapes / sticks / trays / strips · Componets centering · non-contact alignment · Placement rate · up to 3000 cph · Feeder · up to 90 x 8 – automatic tapes feeder and · 2 x (300 x 200mm) - IC-tray with 300 x 300mm PCB size · Resolution · X / Y Axis - 0,008mm · Placement accuracy · +/- 0,025 mm · Dimensions and weight · 1040 x 850 x 1300 mm / ca. 165 kg · Supply · 230 V - 50 Hz - 350 W / 0,6 Mpa -15 l/min · KEY FEATURES · automatic pick and place machine with optical alignment · adjustable speed profiles · automatic nozzle changer (2x6 tools ) · adjustable clamping for fixing the PCB for double sided SMD´s · camerasystem for touchless components centering · CAD – editor - graphical user interface · intelligent feedersystem – CAN Bus · image processing system · flexible feeder changer · self diagnostic and error recognition system · vision systen for fiducial · Application range · middle volume production · pick & place of standard and fine pitch components incl. BGA , ìBGA,QFN,CSP