P40

P40

Product catalog summary
Technical Specifications
  • PCB Placement Area: Maximum 400 x 500mm
  • Component Range: From 0402 to 30 x 30mm, with a minimum pitch of 0.4mm, including BGA and µBGA
  • Component Packaging: Supports tapes, sticks, and trays
  • Component Centering: Non-contact alignment
  • Placement Rate: Up to 2000 components per hour (cph)
  • Feeder Capacity: Up to 80 x 8 automatic tape feeders and 2 IC-trays (300 x 200mm) with 200 x 300mm PCB size
  • Resolution: X/Y Axis - 0.008mm
  • Placement Accuracy: +/- 0.03 mm
  • Dimensions and Weight: 840 x 630 x 430 mm, approximately 95 kg
  • Power Supply: 230 V, 50 Hz, 350 W, 0.6 Mpa, 15 l/min
Key Features
  • Full vision SMT pick and place machine
  • Automatic pick & place head
  • Camera system for automatic fiducial recognition
  • Automatic nozzle changer with 6 tools
  • Camera system for touchless component centering
  • CAD editor for pick & place files
  • Teach-in mode with electronic manipulator
  • Image processing system
  • Intelligent feeder system using CAN Bus
  • Operating System: Windows XP
  • Control Panel: PC keyboard and mouse
  • User Interface: PC with 17” LCD monitor
Application Range
  • Suitable for low and middle volume production
  • Capable of handling standard and fine pitch components, including BGA, µBGA, CSP, and QFN
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Catalog excerpts

P40-1

SMT pick & place system P40 • TECHNICAL DATA • KEY FEATURES • PCB • full vision SMT pick and place machine max. placement area 400 x 500mm • automatic pick & place head • camerasystem for automatic fiducial • automatic nozzle changer (6 tools ) • camerasystem for components centering Componets centering • CAD – editor for pick & place files non-contact alignment • teach-in mode – electronic manipulator Placement rate • image processing system • intelligent feeder system – CAN Bus • operating system: Windows XP • control panel: PC keybord / Mouse • user interface - PC and 17” LCD monitor • Application range · · low and middle volume production pick & place of standard and fine pitch components incl. BGA , µBGA, CSP, QFN • • • • • • • • • • • • • • • • • • Components range from 0402 up to 30 x 30mm Pitch min. 0,4mm BGA / µBGA Components packing tapes / sticks / trays up to 2000 cph Feeder up to 80 x 8 – automatic tape feeder and 2 x (300 x 200mm) - IC-tray with 200 x 300mm PCB size Resolution X / Y Axis - 0,008mm Placement accuracy +/- 0,03 mm • Dimensions and weight • touchless 840 x 630 x 430 mm / ca. 95 kg • • Supply 230 V - 50 Hz - 350 W / 0,6 Mpa -15 l/min • Subject to technical alteration

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