P20

P20

Product catalog summary
Technical Specifications
  • PCB Placement Area: Maximum 400 x 500mm
  • Component Range: From 0402 to 28 x 28mm with a minimum pitch of 0.4mm
  • Component Packing: Supports tapes, sticks, and trays
  • Component Centering: Non-contact alignment
  • Placement Rate: Up to 1100 components per hour (cph)
  • Feeder Capacity: Up to 80 x 8mm tapes (automatic and manual) and 2 IC-trays (300 x 200mm) with 200 x 300mm PCB size
  • Resolution: X/Y Axis – 0.008mm, Z Axis – 0.020mm, Rotation – 0.01°
  • Placement Accuracy: +/- 0.03mm
  • Dimensions and Weight: 840 x 630 x 430 mm, approximately 85 kg
  • Power Supply: 230 V, 50 Hz, 450 W, 0.6 Mpa, 20 l/min
Key Features
  • Precision automatic SMT pick and place machine with optical alignment system
  • Automatic pick & place head with automatic nozzle changer (6 tools)
  • Camera system for automatic fiducial and touchless component centering
  • CAD editor for pick & place files and teach-in mode
  • Vision inspection for solder paste printing accuracy and component placement accuracy
  • Intelligent feeder system with CAN Bus
  • Operating System: Windows
  • Remote service via internet
  • Graphical user interface
Application Range
  • Suitable for prototypes and low volume production
  • Capable of handling standard and fine pitch components including SOIC, PLCC, BGA, µBGA, CSP, QFN, SMD LEDs
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Catalog excerpts

P20-1

P20 - automatic SMT pick & place machine with optical alignment system • TECHNICAL DATA • KEY FEATURES • PCB • precison automatic SMT pick and place machine with optical alignment system • automatic pick & place head • automatic nozzle changer (6 tools ) • camerasystem for automatic fiducial • camerasystem for touchless components centering • max. placement area 400 x 500mm • Components range • • from 0402 up to 28 x 28mm Pitch min. 0,4mm • Components packing • tapes / sticks / trays • Componets centering • non-contact alignment • CAD – editor for pick & place files • Placement rate • teach-in mode • vision inspektion of printing accuracy of solder • up to 1100 cph • Feeder capacity • • • up to 80 x 8mm tapes (automatic+manuel )feeder and 2 x (300 x 200mm) - IC-tray with 200 x 300mm PCB size Resolution • • • X / Y Axis – 0,008mm – linear encoders Z Axis – 0,020mm – linear encoder Rotation – 0,01° – rotation encoder • Placement accuracy • +/- 0,03 mm • Dimensions and weight • • • paste and accuracy of component placement • intelligent feeder system – CAN Bus • operating system: Windows • remote service via internet • Graphical user interface • Application range · · prototypes and low volume production pick & place of standard and fine pitch components incl. SOIC, PLCC, BGA, µBGA, CSP, QFN, SMD LED´s 840 x 630 x 430 mm / ca. 85 kg Supply 230 V - 50 Hz - 450 W / 0,6 Mpa -20 l/min •Subject to technical alteration

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.