Precision SMT pick & place machine - P1 with optical alignment system •Subject to technical alteration · TECHNICAL DATA · PCB · max. placement area 400 x 500mm · Components range · from 0201 up to 30x30mm · Pitch min. 0,4mm · Components packing · tapes / sticks / trays / bulk · Componets centering · non-contact alignment · Placement rate · up to 600 cph · Feeder capacity · up to 80 x 8mm – strips feeder and · 2 x (300 x 200mm) - IC-tray with 200 x 300mm PCB size · Resolution · X / Y Axis – 0,008mm ( linear encoders ) · Z Axis – 0,020mm ( linear encoder ) · Rotation – 0,01° ( rotation encoder ) · Placement accuracy · +/- 0,03 mm · Dimensions and weight · 840 x 630 x 430 mm / ca. 75 kg · Supply · 230 V - 50 Hz - 450 W / 0,6 Mpa -15 l/min · KEY FEATURES · precision automatic SMT pick and place machine with optical alignment system · automatic pick & place head · automatic nozzle changer (6 tools ) · camerasystem for automatic fiducial · camerasystem for touchless components centering · CAD – editor for pick & place files ( all CAD´s ) · vision inspektion of printing accuracy of solder paste and accuracy of component placement · remote service via internet · control panel: PC keybord / Mouse · Graphical user interface · Application range · prototypes and low volume production · pick & place of standard and fine pitch components incl. SOIC, PLCC, BGA , ìBGA, CSP, QFN, LED´s