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MIPTEC catalog

MIPTEC catalog
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Panasonic 3D Packaging Devices Technology that transforms one's imagination into real form

Introducing MIPTEC 3D Packaging Technology What is ( Microscopic Integrated Processing Technology ) ? Three-dimensional injection molded circuit components use MID (Molded Interconnect Device) technology. Further advancements use proprietary surface activation technology and laser patterning. The result is a 3D circuit device with a fine circuit pattern for mounting bare chips. Custom shapes and patterns are produced on an order request basis. ■MID Features Molded components with an electrical circuit directly formed on 3D surfaces. ●Feature integration (mechanical parts + electrical...

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■MIPTEC Examples Reduces Number of Components Through Integration Integrated structure ensures accuracy and reduces total costs. Point MIPTEC integrates two PC boards and one MEMS holder. Angle adjustment is not required during assembly. Application example: Module for micro-projectors (MEMS mirror module) Before After (Image) MIPTEC (Image) MEMS mirror PC board (Y) (Y axis) MEMS mirror (Y axis) Holder (Y) MEMS mirror (X axis) Magnet (Y) Holder (X) Light MIPTEC Magnet (Y) Magnet (X) (Integrated composite structure) MEMS mirror (X axis) PC board (X) Magnet (X) Improves Reflectance and...

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■MIPTEC Benefits a Wide Variety of Devices miniaturization , feature advancement and improve efficiency . MIPTEC devices support Automotive Medical LED Measurement Optical Mobile MEMS ■From Inquiries to Mass Production 1 Technical explanations about MIPTEC (design rules, restrictions) 8 Prototype die production 2 (NDA signing) 9 Prototype sample submission 3 Conceptual drawing and quantity information (Customer → Panasonic) 10 Prototype sample evaluation 4 Feasibility study 11 Production specifications determination (Specifications and drawing submission) 5 Prototype price quotation and...

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Achieved by Technological Advancement Laser patterning technology, surface technology and unique materials achieve size reduction and increased functionality compared to a conventional process. ■Laser patterning process Fine patterning and rapid pattern changes. New technology enables fine pattern electrical circuits on six molded surfaces. Line/Space patterns of 50μm/50μm MIPTEC Achieves compact devices and modules 50μm Component image Pattern changes during the design process using program and software modifications Improves development time and reduces development costs ■ Die...

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■Manufacturing process Molding Circuit forming Requested shape is molded in a sheet form containing multiple units for productivity purposes Laser Metalizing (Cu thin-film forming) Molding Patterning (Removing around pattern) Plating Cutting Au Ni Cu Circuit conductor Dicing Cu Electric Cu-plating Soft etching Electric Ni- and Au-plating Cutting ■Design guidelines Polyphtalamide (PPA) Ceramics (Alumina and aluminum nitride) Min pattern width (a) 50μm 50μm Min. pattern spacing (b) 50μm 50μm 0.25mm 0.4mm 2 2 0.1mm 0.2mm Approx 10mm Approx 10mm Max pattern angle (h) 90° 90° Min molding...

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■Specifications Basic specifications Process Laser thin-film removal method Polyphthalamide (PPA) Molding material Sheet size (recommendation) Alumina (Al2O3) Aluminum nitride (AIN) 50×50mm / 40×40mm / 30×65mm 30×65mm / 50×70mm / 63×55.7mm Number of required molding dies One set Positional accuracy of mold and circuit Normal mode: ±0.05mm or less, High accuracy mode: ±0.03mm or less Possible by changing the laser patterning data (Mold modification is required when changing through-holes.) Pattern change Cu: 10μm, Ni: 6μm, Au: 0.1μm* Plating specifications (standard) ±0.15mm or less (Cut...

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IMIPTEC Website http://industrial.panasonic.eom/ac/e/tech/miptec/index.jsp I Mimic" Q "MIPTEC" Microscopic Integrated Processing Technology MIPTEC. OJ Microscope Irueyrated Processing Tecnnoirjcjy for lorrning an exlreme-.y fine-pattern electrical circuit on a molded component surface *PET j*trtf w: Tecpfiokigy Memorial ■EraJence Award PmducEor IntroduclKHi IDMIFTTC The HID (Three-dimeniiciiial m|ection-molded circuit component) technology for forming an electrical circuit on a molded component surtece has been tur+hoi advanced with the proprietary surface activation technology and...

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