XS-series SMT setup High speed Inline AXI platform with minimal footprint The Nordson MATRIX XS-series platform with SMT setup is a small-footprint automated X-ray inspection system concept designed for sophisticated high-speed inspection of PCBassembly boards for single/multipanels or samples in trays. All solder joints of SMD and PTH components are covered by a dedicated AXI Algorithm Library. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The XS-series platform is available in the following configurations: XS-2 XS-2.5 Transmission (2D) + SFTTM + Off-Axis (2.5D) XS-3 Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Features and Benefits High Speed AXI System for In-line and Off-Line setups Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with servo drives Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Flexible setup for In-line pass through or same-side in/out configuration Barcode scanner for serial number and product type selection product traceability via customized MES-Interface Full Inspection & Process Software Station with multi    ore processor setup PC-  -c Windows 10 platform MIPS Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART; XS-3 only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Off-line programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & process control MIPS Verify link with closed loop repair MIPS Proces with real tim

XS-series SMT setup Applications For more information, speak with your Nordson MATRIX representative. Electronic components and solder joint A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. Germany/ Western Europe Feldkirchen (Munich) +49.89.2000.338.200 Phone [email protected] EMail All standard SMD and THT/PTH components BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder surface / heatsink void inspection...