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XS-series SMT setup

XS-series SMT setup
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XS-series SMT setup

Product catalog summary
Overview: The Nordson MATRIX system solutions offer a modular inspection concept integrating up to four advanced technologies: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D), and 3D SART (Simultaneous Algebraic Reconstruction Technique). The XS-series platform is available in three configurations: XS-2, XS-2.5, and XS-3, each adding more advanced inspection capabilities.
Platform Configurations:
  • XS-2: Transmission (2D) + SFT™
  • XS-2.5: Transmission (2D) + SFT™ + Off-Axis (2.5D)
  • XS-3: Transmission (2D) + SFT™ + Off-Axis (2.5D) + 3D SART
System Features:
  • High-speed automated X-ray inspection for PCB assembly boards.
  • Dedicated AXI Algorithm Library for SMD and PTH components.
  • PC-Station with multi-core processor and Windows 10 platform.
  • Advanced algorithm library with CAD import for automatic inspection list generation.
  • Automatic Tree Classification (ATC) for Auto-Rule-Generation.
  • Off-line programming for AXI program generation and simulation.
  • MIPS Verify link with closed-loop repair and real-time SPC.
Technical Specifications:
  • Dimensions: 1760 mm (H) x 1300 mm (W) x 1600 mm (D).
  • Weight: 2,320 kg.
  • Operating Temperature: 15° - 28°C, optimal 20° - 25°C.
  • Power Consumption: max. 6 kW.
  • Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A / 208 VAC, 50/60 Hz 3 phase, 25 A.
  • Air: 5-7 Bar, < 2 l/min, filtered, dry, oil-free, non-condensing.
X-ray Image Chain:
  • Energy: 100 kV / 20 W and 130 kV / 40 W.
  • Focal Spot Size: 4-5 microns.
  • Grey resolution: up to 14 Bit.
  • Detector Types: CMOS Flatpanel Detector with 50 µm and 75 µm pixel sizes.
Motion System:
  • Multiple axes programmable motion system with x, y, z, u, v movements.
  • Conveyor setup options: pass-through single lane or in-out same side dual lane.
Inspection Capabilities:
  • Max. sample size: 250 mm x 300 mm.
  • Max. inspection area: 250 mm x 300 mm.
  • Min. sample size: 60 mm x 60 mm.
  • Sample thickness: 0.8-10 mm.
  • Max. sample weight: 5 kg.
  • Resolution down to 3-4 µm/pix.
Contact Information: For more information, contact Nordson MATRIX representatives in various regions including Germany, Hungary, USA, Brazil, South East Asia, China, Japan, Korea, Taiwan, and India.
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Catalog excerpts

XS-series SMT setup-1

XS-series SMT setup High speed Inline AXI platform with minimal footprint The Nordson MATRIX XS-series platform with SMT setup is a small-footprint automated X-ray inspection system concept designed for sophisticated high-speed inspection of PCBassembly boards for single/multipanels or samples in trays. All solder joints of SMD and PTH components are covered by a dedicated AXI Algorithm Library. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The XS-series platform is available in the following configurations: XS-2 XS-2.5 Transmission (2D) + SFTTM + Off-Axis (2.5D) XS-3 Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Features and Benefits High Speed AXI System for In-line and Off-Line setups Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with servo drives Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Flexible setup for In-line pass through or same-side in/out configuration Barcode scanner for serial number and product type selection product traceability via customized MES-Interface Full Inspection & Process Software Station with multi    ore processor setup PC-  -c Windows 10 platform MIPS Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART; XS-3 only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Off-line programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & process control MIPS Verify link with closed loop repair MIPS Proces with real tim

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XS-series SMT setup-2

XS-series SMT setup Applications For more information, speak with your Nordson MATRIX representative. Electronic components and solder joint A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. Germany/ Western Europe Feldkirchen (Munich) +49.89.2000.338.200 Phone [email protected] EMail All standard SMD and THT/PTH components BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder surface / heatsink void inspection...

 Open the catalog to page 2

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