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X-series SMT setup
X-series SMT setup
The X-series SMT setup by Nordson MATRIX is a high-speed automatic X-ray inspection system designed for PCB assembly boards. It supports single/multipanels or samples in trays, covering all solder joints of SMD and PTH components with a dedicated AXI algorithm library.
- X2: Transmission (2D) + SFT™
- X2.5: Transmission (2D) + SFT™ + Off-Axis (2.5D)
- X3: Transmission (2D) + SFT™ + Off-Axis (2.5D) + 3D SART
- PC-Station with multi-core processor and Windows 10
- MIPS 5 Inspection Platform with advanced algorithm library
- CAD import for automatic inspection list generation
- 3D SART available in X3 configuration
- Automatic Tree Classification (ATC) for Auto-Rule-Generation
- Offline programming for AXI program generation and simulation
- High-speed AXI system for inline setups
- Microfocus X-ray tube (sealed tube, maintenance-free)
- Multiple programmable motion system with linear motor axes
- Digital CMOS flat panel detector
- Automatic grey-level and geometrical calibration
- Barcode scanner for serial number and product type selection
- Full product traceability via Industry 4.0 MES-Interfaces
- IPC-CFX ready
- Dimensions: 1630 mm (H) x 1800 mm (W) x 1575 mm (D)
- Weight: 2,800 kg
- Operating Temperature: 15° - 28°C, optimal 20° - 25°C
- Power Consumption: max. 6 kW
- Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A / 208 VAC, 50/60 Hz 3 phase, 25 A
- Air: 5-7 Bar, < 2 l/min, filtered (30µ), dry, oil-free
- X-ray Source: Sealed tube, 130 kV/40 W
- Grey resolution: 14 Bit
- Detector Types: CMOS Flatpanel Detector with 50 µm and 75 µm pixel sizes
- Multiple axes programmable motion system
- Installed axes: x, y (linear drives), z (servo), u, v (linear drives)
- Max. sample size: 460 mm x 360 mm
- Max. inspection area: 460 mm x 360 mm
- Min. sample size: 80 mm x 80 mm
- Sample thickness: 0.8-10 mm
- Max. sample weight: 5 kg
- Angle shot capability: up to 50 degrees
- Resolution: 3-4 µm/pix
- Barcode reader
- Low-dose radiation filter
- Auto BCR scanning station (x-y gantry)
For more information, contact Nordson MATRIX representatives in various regions including Germany, Hungary, Americas, South East Asia, China, Japan, Korea, Taiwan, and India.
Catalog excerpts
Solder Joint Inspection Power devices Cooling plates High Speed Inline AXI Platform With the X-series platform Nordson MATRIX presents a dedicated high speed automatic X-ray inspection system concept for the inspection of PCB-assembly boards for single/multipanels or samples in trays. All solder joints of SMD and PTH components are covered by a dedicated AXI algorithm library. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The X-series platform is available in the following configurations: X2 Transmission (2D) + SFTTM + Off-Axis (2.5D) Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Inspection & Process Software PC- Station with multi - core processor setup Windows 10 platform MIPS 5 Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART; X3 only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Offline programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & Process control MIPS Verify link with closed loop repair MIPS Process with real time SPC Features and Benefits High Speed AXI system for inline setups Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with linear motor axes Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Barcode scanner for serial number and product type selection Full product traceability via various Industry 4.0 MES-Interfaces IPC-CFX
Open the catalog to page 1
X-series SMT setup Applications Electronic components and solder joint For more information, speak with your Nordson MATRIX representative. A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. All standard SMD and THT/PTH components Germany/ Western Europe Feldkirchen (Munich) BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder / heatsink void inspection Pin in paste barrel fill measurement Discrete down to 1005...
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