X-series SMT setup
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Solder Joint Inspection Power devices Cooling plates High Speed Inline AXI Platform With the X-series platform Nordson MATRIX presents a dedicated high speed automatic X-ray inspection system concept for the inspection of PCB-assembly boards for single/multipanels or samples in trays. All solder joints of SMD and PTH components are covered by a dedicated AXI algorithm library. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The X-series platform is available in the following configurations: X2 Transmission (2D) + SFTTM + Off-Axis (2.5D) Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Inspection & Process Software PC- Station with multi - core processor setup Windows 10 platform MIPS 5 Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART; X3 only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Offline programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & Process control MIPS Verify link with closed loop repair MIPS Process with real time SPC Features and Benefits High Speed AXI system for inline setups Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with linear motor axes Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Barcode scanner for serial number and product type selection Full product traceability via various Industry 4.0 MES-Interfaces IPC-CFX

X-series SMT setup Applications Electronic components and solder joint For more information, speak with your Nordson MATRIX representative. A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. All standard SMD and THT/PTH components Germany/ Western Europe Feldkirchen (Munich) BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder / heatsink void inspection Pin in paste barrel fill measurement Discrete down to...